| Allicdata Part #: | 528-45AB-MS4-ND |
| Manufacturer Part#: |
528-45AB-MS4 |
| Price: | $ 0.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK BXB50,75,100,150.45"VRT |
| More Detail: | Heat Sink Half Brick DC/DC Converter Aluminum 7.0W... |
| DataSheet: | 528-45AB-MS4 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | 0.00000 |
| Series: | 528 |
| Part Status: | Obsolete |
| Type: | Board Level |
| Package Cooled: | Half Brick DC/DC Converter |
| Attachment Method: | Bolt On, Thermal Material |
| Shape: | Rectangular, Fins |
| Length: | 2.402" (61.00mm) |
| Width: | 2.280" (57.91mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | 7.0W @ 60°C |
| Thermal Resistance @ Forced Air Flow: | 3.20°C/W @ 300 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Heat sinks are devices used cooling electronic components. The 528-45AB-MS4 is a thermal heat sink that consists of aluminum, copper, or a combination of both metals. It is designed specifically to dissipate heat away from electronics. By transferring heat away from electronics, the 528-45AB-MS4 keeps the parts at a temperature that prevents them from becoming damaged from overheating. The 528-45AB-MS4 is an efficient heat sink because of its material construction and design.
The 528-45AB-MS4 thermal heat sink is constructed using aluminum, copper, or a combination of both metals. Aluminum is an effective conductor of heat and has a high strength-to-weight ratio, making it a great choice for heat dissipation. Copper is also an effective conductor of heat and has excellent thermal conductivity for its weight. The combination of both metals provides a superior heat-dissipation capability.
The 528-45AB-MS4 features an efficient heat transfer design, which uses both convective and radiative cooling to dissipate heat away from the component. The convective cooling process works by circulating air around the heat sink, reducing the temperature of its surface. Radiative cooling happens when the heat sink\'s surface absorbs and emits infrared energy, allowing it to move the heat away from the component. Both of these processes, when combined with the natural properties of aluminum and copper, make the 528-45AB-MS4 an effective thermal heat sink.
The 528-45AB-MS4 is most often used to cool the components of computers, electronic devices, and power supplies. It can also be used as a cooling device in extreme temperatures, such as in industrial or harsh environments. The aluminum construction of the 528-45AB-MS4 prevents oxidation over time, so its use is ideal in environments where corrosion is a concern. The light weight of the aluminum also makes this thermal heat sink a great choice for applications that require minimal structural support.
The 528-45AB-MS4 thermal heat sink is an effective way to cool down and prevent overheating of electronic components in computers, power supplies, and other devices. It uses aluminum and copper to create a durable and lightweight construction that is capable of dissipating heat quickly and efficiently. The combination of convective and radiative cooling technologies also makes it an effective way to keep parts at a temperature that prevents damage. The 528-45AB-MS4 is a great choice for extreme temperature environments, as well as for applications where minimal structural support is needed.
The specific data is subject to PDF, and the above content is for reference
528-45AB-MS4 Datasheet/PDF