530002B02500G Allicdata Electronics
Allicdata Part #:

HS380-ND

Manufacturer Part#:

530002B02500G

Price: $ 1.11
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEATSINK TO-220 POWER W/PINS BK
More Detail: Heat Sink TO-220 Aluminum 20.0W @ 60°C Board Level...
DataSheet: 530002B02500G datasheet530002B02500G Datasheet/PDF
Quantity: 7420
1 +: $ 1.00800
10 +: $ 0.95760
25 +: $ 0.93240
50 +: $ 0.90720
100 +: $ 0.85680
250 +: $ 0.80640
500 +: $ 0.75600
1000 +: $ 0.70560
5000 +: $ 0.68040
Stock 7420Can Ship Immediately
$ 1.11
Specifications
Series: --
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Shape: Rectangular, Fins
Length: 2.500" (63.50mm)
Width: 1.650" (41.91mm)
Diameter: --
Height Off Base (Height of Fin): 1.000" (25.40mm)
Power Dissipation @ Temperature Rise: 20.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 2.60°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks, such as the 530002B02500G, are designed to transfer thermal energy from a hot object or surface into the surrounding environment or medium. Heat sinks are a type of passive heat exchanger, which works by dissipating heat generated by an electrical component or circuit into the surrounding air. In this way, the temperatures of the component or circuit remain below critical levels and the components remain functional. The 530002B02500G is an example of such a passive heat exchanger.

The 530002B02500G is a direct contact heat sink, which is designed to provide the best thermal performance under an array of different operating conditions. The 530002B02500G is designed to dissipate heat mainly through conduction, where its finned aluminum body acts as a conductor to dissipate heat over its large surface area, which allows for a much better thermal exchange than a comparable component. The aluminum fins provide a high amount of cooling surface area and are designed to minimize the amount of air resistance.

The 530002B02500G heat sink is designed to be used in environments and/or applications where thermal management is essential. Its large surface area and high amount of finned aluminum in combination with its fin spacing provides efficient cooling for a variety of applications, ranging from medical and electronic telecommunications to power semiconductor devices. In addition, its excellent design provides performance reliability while also ensuring that there is no thermal break from the heat sink to the component it is cooling.

The 530002B02500G heat sink has a very simple, yet effective working principle. It operates by using its large surface area and efficient cooling to dissipate heat in order to keep components at or below critical temperatures. Heat is conducted through the aluminum finned body and spread over the large surface area, which facilitates a faster heat transfer rate than would be expected from a comparable component. Its fin spacing is designed to provide minimal air resistance, making it even more efficient.

The 530002B02500G heat sink is ideal for applications where thermal management is crucial. Its simple, yet efficient design ensures optimal performance in a wide range of environments. Its large surface area and finned aluminum body allow for greater thermal transfer compared to a similar component, while also providing a reliable and durable solution. In addition, its fin spacing allows for minimal air resistance, further enhancing its performance.

The specific data is subject to PDF, and the above content is for reference

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