5352112-2 Allicdata Electronics

5352112-2 Connectors, Interconnects

Allicdata Part #:

5352112-2-ND

Manufacturer Part#:

5352112-2

Price: $ 1.78
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN RCPT Z-PACK SHLD 2MM HM PCB
More Detail: N/A
DataSheet: 5352112-2 datasheet5352112-2 Datasheet/PDF
Quantity: 1077
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: $ 1.61280
10 +: $ 1.54665
25 +: $ 1.41800
50 +: $ 1.35349
100 +: $ 1.28898
250 +: $ 1.12785
500 +: $ 1.09563
1000 +: $ 0.93451
2500 +: $ 0.87006
Stock 1077Can Ship Immediately
$ 1.78
Specifications
Series: Z-PACK
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Accessory Type: Ground Shield
For Use With/Related Products: Z-Pack Series
Specifications: Type C/M, Lower
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane Connectors - Accessories are essential components to maintain reliable connectivity between boards or modules within a larger system architecture. The 5352112-2 Connector is an innovative product designed to provide high performance and simplified setup. This article will discuss the application field and working principle of the 5352112-2 Connector.

The 5352112-2 Connector is a type of backplane connector designed specifically for data communications interconnect solutions. It is well suited for both PCB and mezzanine applications in industrial and telecom applications. In a PCB application, the connector can be used to connect multiple layers of a board, and in a mezzanine application, it can be used to connect two boards together.

The 5352112-2 Connector has been designed to deliver exceptional signal integrity performance. It utilizes patented dielectric materials within its housing material and a printed circuit board layout that minimizes crosstalk. The positions and lead lengths of the board housing have also been designed to minimize skew and ringing. Additionally, the connector\'s contact system has been developed to offer extremely low insertion force and reputable disconnect strength. This connector is perfect for high speed board-to-board connections due to its low upstream and downstream transmission loss.

In terms of the working principle, the 5352112-2 Connector utilizes a high-power switching process. The connector features a contact system that features a robust contact system designed to provide reliable board-to-board connections. Its contact system is designed to provide reliable contact between boards even with cycles of extreme temperature moving from cold to hot. The connector\'s contact system is capable of carrying both power and data signals making it well suited for a range of application, particularly those which require robust performance in challenging operating conditions.

Additionally, the 5352112-2 Connector also offers simplified setup. The connector features a snap-in design that eliminates the need for difficult installation and requires minimal time to fit. This allows for a quicker and simpler implementation of the connection between boards. In addition, the connector\'s contact system also prevents solder breakthroughs meaning that the high power switching process can be achieved without excessive heat buildup on the board.

In conclusion, the 5352112-2 Connector is a perfect solution for data communications interconnect solutions. It is an innovative product designed to provide high performance and simplified setup. The connector features a robust contact system designed to provide reliable board-to-board connections even with cycles of extreme temperature moving from cold to hot. Additionally, this connector also offers simplified setup with its snap-in design that eliminates the need for difficult installation. It is perfectly suited for high speed board-to-board connections, providing excellent signal integrity performance while minimizing crosstalk, skew, and ringing.

The specific data is subject to PDF, and the above content is for reference

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