536501-3 Allicdata Electronics
Allicdata Part #:

A3264-ND

Manufacturer Part#:

536501-3

Price: $ 6.08
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN HEADER VERT 2MM 96POS 30AU
More Detail: N/A
DataSheet: 536501-3 datasheet536501-3 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS non-compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
144 +: $ 5.52449
Stock 1000Can Ship Immediately
$ 6.08
Specifications
Series: Z-PACK
Packaging: Tube 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Header, Male Pins
Connector Style: Futurebus
Number of Positions: 96
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Columns: --
Mounting Type: Through Hole
Termination: Solder
Contact Layout, Typical: --
Features: Board Guide
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Color: --
Current Rating: --
Material Flammability Rating: UL94 V-0
Operating Temperature: -55°C ~ 125°C
Voltage Rating: 30V
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane Connectors - Specialized are designed for a variety of high-density applications and must provide robust electrical performance. The 536501-3 application field and working principle is a specialized backplane connector designed for telecommunications and high-performance computing applications. It is ideal for digital voice, data, and video systems. More specifically, it is designed for applications where space savings, rapid system reconfiguration, and direct current (DC) current (I/Os) requirements are key factors.

536501-3 defines the physical and electrical characteristics of an advanced high-density backplane interconnect system. It utilizes a 21 mm grid pattern which allows for precise and efficient routing of 100 to 600 electrical contacts within the same form factor. In addition, the connector provides full signal bandwidth, EMI/EMC performance, improved shock and vibration resistance, and improved reliability.

Working principle of 536501-3 backplane connector are under their “X-Y” arrangement. In the X-Y arrangement, all pins are placed in the same plane and connected to the center of the board. The arrangement allows for signals to travel along either the X or Y axis and maintains the same signal propagation speed for all signals. The pins are connected together using special “X-Y tunnels”, which provide a full layout of connections between the pins and the center of the board. This provides a high degree of signal integrity as well as improved reliability.

The 536501-3 interface is optimized to provide stable and reliable data transmission. It has the capability to reach data rates of over 10 Gb/s, and can support up to 48 ports. It also offers signal reliability through improved EMI/EMC shielding, and ESD protection. As its X-Y design ensures that all signal propagation speeds remain equal, the connection can be used with a wide variety of applications, from high-end telecommunications systems to digital video and data streaming.

The 536501-3 backplane connector provides an excellent backbone for high-speed signal routing. With its increased signal integrity and improved EMI/EMC shielding, it is an excellent choice for applications requiring reliable data transmission and rapid system reconfiguration. The standardization of the connector ensures that all systems using it as the backbone will be able to interoperate with each other and form a greater network.

The specific data is subject to PDF, and the above content is for reference

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