| Allicdata Part #: | 537-95AB-ND |
| Manufacturer Part#: |
537-95AB |
| Price: | $ 2.01 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK DC DC 1/4 BRICK VERT |
| More Detail: | Heat Sink Quarter Brick DC/DC Converter Aluminum ... |
| DataSheet: |  537-95AB Datasheet/PDF |
| Quantity: | 1000 |
| 640 +: | $ 1.80837 |
| Series: | 537 |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Quarter Brick DC/DC Converter |
| Attachment Method: | Bolt On |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.950" (24.13mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.10°C/W @ 300 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal – Heat Sinks
Heat sinks are commonly used in a wide range of applications, from domestic to industrial. They are used to transfer heat away from a certain object, so as to preserve its integrity or to make it operate efficiently. Heat sinks also play a major role in cooling electronic components such as CPUs, GPUs, and other chip-level devices. The most common technology used in heat sinks is the 537-95AB. This technology is employed for heat dissipation in all shapes and sizes, from tiny surface mount packages to large computer processors.
The 537-95AB itself is a device with an embedded heatsink assembly in its center. It is composed of a copper base, a heatpipe, a top fin stack and an insulating layer. It is designed to operate between -40°C and +125°C and has a thermal resistance of less than 0.212°C/W. The copper base and the heatpipe are the main components responsible for heat transfer, while the top fin stack and the insulating layer are used for temperature control.
The working principle of the 537-95AB is based on convection, radiation, and conduction. The copper base is responsible for conducting the heat away from the object to the heatpipe, which in turn radiates it towards the fin stack. The fin stack dissipates the heat via convectional air coolants, while the insulating layer controls the temperature of the fins so as to limit and distribute the heat more evenly.
By using the 537-95AB, users have been able to reduce the temperature of components and systems with improved efficiency. Aside from that, additional benefits include improved reliability, longer life-spans of components, and cost savings. This heat sink technology has also been employed in everyday gadgets such as laptops, smartphones, and gaming consoles as well as industrial machines and automotive applications.
Heat sinks are vital components when it comes to thermal management. It is important to choose the right one that is suitable for the application in order to maximize its efficiency. The 537-95AB technology is a great option for a wide range of applications, from domestic to industrial. It has proven to be effective in cooling electronic components, extending the life-span of components and reducing manufacturing costs.
The specific data is subject to PDF, and the above content is for reference