547-95AB

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management or heat sinks have been around for centuries and have evolved over the years to become more efficient at dissipating the heat generated during electronic component operation. Heat sinks are designed to transfer heat away from sensitive components, increasing the reliability of the system and reducing downtime due to component failure caused by overheating. 547-95AB is one such thermal management solution.

The 547-95AB is a type of heat sink which uses forced convection to wick heat away from the component and disperse it into a large surface area with grooves machined into the side walls of the base of the heat sink. The shallow angle of these grooves helps to direct the flow of air in an organized fashion away from the component. The design also works well for densely populated applications, as the airflow travels past the components, cooling them down.

The 547-95AB is designed to handle a range of electronic components from power supplies, transistors, and surge suppressors to LEDs and other low and medium power components. The heat sink is also suitable for a variety of applications including, computer systems, networking devices, air-conditioning systems, and medical imaging equipment.

The 547-95AB features a base made of aluminum, which is a very good thermal conductor, and a machined fin array to improve heat transfer efficiency. The fin array allows more air exposure to the aluminum heat sink base, increasing the rate of heat absorption and effectively dissipating it into the environment. In addition, the fin array increases air velocity for enhanced cooling and provides a thicker surface for more efficient heat transfer.

The 547-95AB can be mounted directly onto any PCB via its standard four-hole mounting pattern either it can also be mounted onto the side of a heat-sinking panel if larger surface area is required. Capacitors with voltage ratings of up to 500 volts can also be mounted directly onto the 547-95AB. This thermal management solution is designed to provide superior cooling performance for medium-sized components, and provides the user with 20%–30% more cooling than traditional heat sink designs.

The 547-95AB features an improved airflow patterning capability, providing more efficient cooling than traditional heat sinks and eliminating hot spots. Its innovative design is also cost-effective, as it can be reused for multiple applications and requires minimal maintenance.

In summary, the 547-95AB thermal management solution is a heat sink designed to dissipate the heat generated by electronic components, increasing their reliability and reducing downtime due to overheating. It is suitable for a variety of applications where medium-sized components require cooling, and provides superior cooling performance and increased efficiency compared to traditional heat sinks.

The specific data is subject to PDF, and the above content is for reference