| Allicdata Part #: | 550202D00000G-ND |
| Manufacturer Part#: |
550202D00000G |
| Price: | $ 1.59 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
| Short Description: | BOARD LEVEL HEAT SINK |
| More Detail: | Heat Sink TO-220 1.5W @ 20°C Board Level, Vertica... |
| DataSheet: |  550202D00000G Datasheet/PDF |
| Quantity: | 1000 |
| 3000 +: | $ 1.42997 |
Specifications
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | Bolt On and PC Pin |
| Shape: | Rectangular |
| Length: | 1.675" (42.55mm) |
| Width: | 1.000" (25.40mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.000" (25.40mm) |
| Power Dissipation @ Temperature Rise: | 1.5W @ 20°C |
| Thermal Resistance @ Forced Air Flow: | 3.00°C/W @ 700 LFM |
| Thermal Resistance @ Natural: | 12.40°C/W |
| Material: | -- |
| Material Finish: | Tin |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are a commonly used component in many engineering fields. In order to effectively reduce heat, heat sinks are used to transfer thermal energy from one object to another.The 550202D00000G is a highly efficient heat sink designed to effectively cool components in electronic applications, as well as any other extreme temperature environment that requires precise heat control. The device offers industry-leading thermal properties due to its close-proximity surface-area design.The 550202D00000G is designed to dissipate extremely high temperatures quickly and efficiently. Its unique combination of heat transfer, thermal management, and robustness make it perfect for many application areas. The device is an especially good choice for integrated circuits, computer components, military, medical, and aerospace applications due to its reliable cooling capabilities.When properly applied, the 550202D00000G provides superior thermal performance by dissipating heat away from critical components and transferring it to the surrounding environment. The device is engineered to capture and absorb extreme temperature changes while acting as a buffer between the component and the environment. This ensures components remain at optimal temperatures and are able to continue in their operation without interruption.The device has a two-phase construction, which enables it to offer both surface-area and direct-contact cooling capabilities. The surface-area is optimized for natural air-cooling, while the direct-contact cooling is designed to perform more effectively and more quickly than air-cooling. This combination of technology allows for efficient heat transfer away from the component and into the surrounding environment.The 550202D00000G is also designed to minimize noise levels through its precision dampening mechanisms. The device is optimized to ensure operation is nearly silent in order to meet the needs of any application that requires noise reduction.The device also offers features like dust-free design, anti-vibration rubber feet, and multiple mounting solutions, making it an incredibly versatile thermal solution for a variety of applications. Its design allows for convenient installation and low maintenance, making it a great choice for any project that requires reliable cooling performance. The 550202D00000G is ideal for any application that requires aerodynamic or extreme temperature operation. Its robust design, superior thermal properties, and noise reduction features make it the perfect device for any environment requiring tough thermal cooling solutions.
The specific data is subject to PDF, and the above content is for reference
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