
Allicdata Part #: | 5532446-7-ND |
Manufacturer Part#: |
5532446-7 |
Price: | $ 5.75 |
Product Category: | Connectors, Interconnects |
Manufacturer: | TE Connectivity AMP Connectors |
Short Description: | ASSY PIN VERTICAL HDI LEAD-FRE |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1800 +: | $ 5.22522 |
Series: | HDI (High Density Interconnect) |
Packaging: | Bulk |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Connector Usage: | -- |
Connector Type: | Header, Male Pins |
Connector Style: | High Density (HDC, HDI, HPC) |
Number of Positions: | 80 |
Number of Positions Loaded: | All |
Pitch: | 0.100" (2.54mm) |
Number of Rows: | 2 |
Number of Columns: | -- |
Mounting Type: | Through Hole |
Termination: | Press-Fit |
Contact Layout, Typical: | -- |
Features: | Mating Guide |
Contact Finish: | Gold |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Color: | Natural |
Current Rating: | -- |
Material Flammability Rating: | UL94 V-0 |
Operating Temperature: | -65°C ~ 125°C |
Voltage Rating: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Backplane connectors are designed to transfer large amounts of data at high speeds. The 5532446-7 backplane connector is specialized in providing reliable, high-speed connections in data-intensive applications. This article will discuss the application field and working principle of the 5532446-7 backplane connector.
The 5532446-7 backplane connector is built to provide secure, high-speed connectivity in data-intensive applications. This is due to its unique design which incorporates both edge connectors and matrices that are connected through channels and pins. These edge connectors are designed to directly mate with other components, providing a secure connection with lower crosstalk and latency levels than traditional connectors. The pins and channels are also used to increase connection stability and reduce the amount of power required for data transmission.
The 5532446-7 is suitable for a wide range of application fields. For instance, it can be used in systems that require high-speed data transmission, such as the data center and data acquisition systems. Additionally, it is also suitable for applications related to high-bandwidth communications, such as financial transactions, video streaming, and voice over internet protocol (VoIP). Furthermore, it is also ideal for embedded applications, as it allows for the transmission of high-speed signals even in the presence of interference.
In terms of its working principle, the 5532446-7 utilizes two distinct parts–the edge connectors and the matrix–to provide a reliable connection. First, the edge connectors mate with devices that require an electrical connection directly, such as memory chips and controllers. The edge connectors then transfer data through the channels and pins of the matrix. This gives the 5532446-7 the ability to provide a low-latency, high-speed connection, which makes it suitable for data-intensive applications.
To ensure further reliability, the 5532446-7 may be configured with a variety of contact points. These contact points can be configured for contacts of various sizes, materials, and shapes. This allows the 5532446-7 to provide a secure connection and allows it to operate over a wide range of temperatures, voltages, and frequencies. Additionally, the 5532446-7 can also be configured to reduce risk of crosstalk and noise interference.
In conclusion, the 5532446-7 backplane connector is designed to provide reliable, high-speed connections in data-intensive applications. It utilizes edge connectors and matrices to transfer data and can be configured with a variety of contact points to reduce noise interference and crosstalk. The 5532446-7 is suitable for applications such as data centers, data acquisition systems, financial transactions, voice over internet protocol (VoIP), and embedded applications.
The specific data is subject to PDF, and the above content is for reference
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