| Allicdata Part #: | ATS1307-ND |
| Manufacturer Part#: |
ATS-55325R-C1-R0 |
| Price: | $ 5.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 32.5 X 32.5 X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55325R-C1-R0 Datasheet/PDF |
| Quantity: | 600 |
| 1 +: | $ 4.85100 |
| 10 +: | $ 4.71870 |
| 25 +: | $ 4.45662 |
| 50 +: | $ 4.19454 |
| 100 +: | $ 3.93233 |
| 250 +: | $ 3.67018 |
| 500 +: | $ 3.40802 |
| 1000 +: | $ 3.34249 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.280" (32.51mm) |
| Width: | 1.280" (32.51mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.60°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-55325R-C1-R0 is a cutting-edge thermal device designed to perform a vital function in industrial and commercial spaces. It is a heat sink, primarily used to manage the temperature of electronic circuit boards, providing efficient heat dissipation and improving the reliability and durability of components. The design of the ATS-55325R-C1-R0 makes it particularly suited to large-scale projects, such as data centers and high-performance computing applications, where high thermal stability is essential.
The ATS-55325R-C1-R0 is a single-piece, high-tech copper alloy frame heat sink with an optimized fin design for improved heat dissipation. It features a split fin design that provides increased thermal conductivity and allows air to move seamlessly across the flat surfaces of the fins, resulting in enhanced heat transfer efficiency. The design also ensures that heat is efficiently dissipated across a wide area. In addition, the ATS-55325R-C1-R0 utilizes a highly efficient thermal grease which maximizes thermal performance and reduces hotspots.
The primary working principle of the ATS-55325R-C1-R0 is thermal conduction. As components heat up, the energy is transferred to the thermal grease between the heat sink and the component, which subsequently conducts the heat energy away from the component towards the heat sink. Once the heat energy reaches the heat sink, the fins act as a cooling mechanism, dissipating the energy across their surface. This removal of heat energy creates a cooling effect, effectively bringing the temperature back to a safe level.
The ATS-55325R-C1-R0 has a number of applications which make it a great choice for a variety of needs. It is suitable for use in applications such as data centers, server farms, high-performance computing, gaming consoles, and medical/scientific equipment. In these types of environments, the heat sink’s superior thermal management capabilities ensure that components remain within their maximum temperature operating range, preventing them from overheating. This leads to improved system reliability and durability, as well as improved system performance.
In conclusion, the ATS-55325R-C1-R0 is a cutting-edge thermal solution, suited to a variety of demanding environments. Its highly efficient design allows for improved thermal performance and enhanced heat dissipation. This, combined with its wide range of applications, makes the ATS-55325R-C1-R0 an excellent choice for thermal management tasks.
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