5532448-2 Allicdata Electronics
Allicdata Part #:

5532448-2-ND

Manufacturer Part#:

5532448-2

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN HDI PLUG 120POS 4ROW VERT
More Detail: N/A
DataSheet: 5532448-2 datasheet5532448-2 Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Vendor undefined / RoHS Compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: --
Voltage Rating: --
Operating Temperature: -65°C ~ 125°C
Material Flammability Rating: UL94 V-0
Current Rating: --
Color: Black
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold
Features: Mating Guide
Contact Layout, Typical: --
Termination: Press-Fit
Mounting Type: Through Hole
Series: HDI (High Density Interconnect)
Number of Rows: 4
Pitch: 0.100" (2.54mm)
Number of Positions Loaded: All
Number of Positions: 120
Connector Style: High Density (HDC, HDI, HPC)
Connector Type: Header, Male Pins
Connector Usage: --
Moisture Sensitivity Level (MSL): --
Part Status: Obsolete
Lead Free Status / RoHS Status: --
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane Connectors - Specialized series are designed to meet the needs of high-speed data transmission, high-frequency signal integrity, and system performance. The 5532448-2 application field and working principle is a type of backplane connector which is used in either telecommunications or networking applications. This connector has high-speed, low-profile, and a reliable connection. Additionally, it provides signal transmission for both digital and analog signals.

5532448-2 is a 2-row, high-density, miniaturized backplane connector designed for high-speed and high-frequency application. It has mating surfaces that are electrostatically protected gold-plated and is specially designed to optimize high-speed data transmission. The connector\'s 2-row design uses a space saving approach for the board and cable interface aiding in the demand for higher port density applications. With the 5532448-2 connector\'s reduced profile, it is ideal for miniature applications such as microcomputer boards.

The main benefit of 5532448-2 is its improved signal integrity resulting from the Low Insertion Loss Technology. This technology allows for improved signal power transmissions by minimizing insertion losses from the contact interface. This connector also features a differential pair Tri-point Contact System which helps provide reliable connections and 5-point contact specification. Additionally, the use of an optimized compliant pin, with an increased number of contact points along the walls of the socket, also helps to improve signal integrity.

The 5532448-2 application field and working principle can be broadly applied in telecom and networking applications - such as LTE base stations, next-generation high-end switches, and server boards. The compatibility and improved signal integrity of the 5532448-2 connectors provide an ideal solution for these high-speed, high-frequency applications where reliable data transmission is essential.

This connector provides between 1 and 100 mating cycles. When this connector is mated and unmated, it produces a low-SPR (simultaneous pressure release) contact technology. This ensures that when mating occurs, the contact pressures are reduced which helps minimize insertion loss. Additionally, it helps increase the contact life while minimizing wear caused by continuous mating and unmating of the connector.

The 5532448-2 connector has a variety of features that make it ideal for telecom and network applications. These features include: its small size, high density, dual contacts, and low insertion loss that together make it a reliable and efficient solution for high-speed, high-frequency applications. Additionally, its numerous mating cycles and low-SPR contact technology reduce insertion loss and increase contact life. With its reduced profile, it is the perfect solution for microcomputer boards and other miniature applications.

The specific data is subject to PDF, and the above content is for reference

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