55660-20302 Connectors, Interconnects

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Memory Connectors - Inline Module Sockets have become the industry standard for high-density, high-performance data transfer performance. The 55660-20302 Inline Module Socket is the latest addition to this family of connectors, providing customers with an even higher level of performance and reliability. This article will discuss the application field and working principles of the 55660-20302.

Application Field

The 55660-20302 Inline Module Socket is designed to meet the demands of high-volume, high-bandwidth applications. This connector can be found in a wide range of consumer and professional products such as portable electronics, gaming consoles, mobile phones, servers, and data storage systems. The 55660-20302 has a high-density layout that enables simultaneous data transmission on multiple channels. This makes it ideal for applications that require multiple channels for data transfer, such as virtual reality (VR), augmented reality (AR), 3D video capture, and streaming video.

The 55660-20302 is also suitable for consumer and enterprise applications that require large storage capacity and high read/write performance. With the ability to handle up to 8TB of storage at up to 1600 Mbps, the 55660-20302 is the perfect connector for large-scale storage solutions and enterprise applications. The 55660-20302\'s high-bandwidth connections make it ideal for high-speed data transfer of large volumes of data such as images, video, audio, and other media.

In addition to its high-density layout and read/write performance, the 55660-20302 also has a high level of durability and resistance to vibration, making it suitable for a wide range of applications that require reliable performance in challenging environments. This makes the 55660-20302 ideal for applications that require a high level of performance but cannot compromise on durability and reliability.

Working Principle

The 55660-20302 Inline Module Socket employs a unique combination of mechanical and electrical design features to provide reliable data delivery. The connector utilizes two contact systems, a socket substrate and a rigid locking latch. The socket substrate has a contact surface that interfaces with the contacts of the device being connected. The contacts of the device connect to the socket substrate via a sprung-loaded contact system. The socket substrate provides a low contact resistance which helps to ensure that data transmission is accurate and reliable.

The rigid locking latch is designed to ensure that the two connected components remain connected no matter the vibration or shocks encountered. The latch is mechanically activated by a spring loaded plunger that engages the latch arm as the connection is made. The plunger is designed to engage the latch with precision, ensuring that the connection remains secure and reliable.

The 55660-20302 Inline Module Socket also has an integrated strain relief. This strain relief creates a circuit path that prevents current induced noise from being created. This helps to ensure that data transmission remains stable and reliable regardless of the environment the connector is used in. This integrated strain relief is designed to be more robust than other design solutions, offering protection from environmental conditions such as vibration, shock, temperature, and humidity.

Conclusion

The 55660-20302 Inline Module Socket is an excellent choice for applications that require reliable and high-performance data transfer. With its high-density contact system and rigid locking latch, this connector is designed to provide reliable performance in the most challenging environments. The integrated strain relief helps to protect the connection from induced noise, and the socket substrate provides low contact resistance for accurate data delivery. With these features, the 55660-20302 is well-suited for consumer electronics, mobile devices, servers, and other high-volume, high-bandwidth applications.

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