55737-001 Allicdata Electronics
Allicdata Part #:

55737-001-ND

Manufacturer Part#:

55737-001

Price: $ 25.56
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: ARRAY MALE 200POS 1.3MM GOLD
More Detail: 200 Signal (100 Pair) Position Connector Different...
DataSheet: 55737-001 datasheet55737-001 Datasheet/PDF
Quantity: 1000
420 +: $ 23.23170
Stock 1000Can Ship Immediately
$ 25.56
Specifications
Series: GIG-Array®, MezzSelect™
Packaging: Tray 
Part Status: Active
Connector Type: Differential Pair Array, Male
Number of Positions: 200 Signal (100 Pair)
Pitch: 0.051" (1.30mm)
Number of Rows: 18
Mounting Type: Surface Mount
Features: --
Contact Finish: Gold or Gold, GXT™
Contact Finish Thickness: --
Mated Stacking Heights: 15mm, 20mm, 25mm
Height Above Board: 0.380" (9.64mm)
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The 55737-001 is a rectangular connector array, edge type, mezzanine (board-to-board) component designed for applications that require a high-speed connection, as well as enhanced durability. These components are quad-row, with dual row polarizing, and are constructed from high-grade stainless steel and aluminum alloy to maximize strength and increase impact resistance. They are commonly used in consumer electronics, medical devices, automotive applications, industrial applications, and many more.

The 55737-001 is designed to provide a secure connection between two printed circuit boards. Its unique frame design allows for a double-row interstitial solder cup feature, which ensures a strong bond between the two boards. Additionally, the two metal posts on the housing provide enhanced shielding and grounding protection, while the spring-loaded contacts provide an audible, secure engagement. The contact contacts are rated at 1.7A at a temperature of 60°C, providing a reliable expansion capability.

The 55737-001 is also designed for high-speed applications, with a maximum connection speed of 250 MHz. Its robust construction and tightly-packed contacts ensure high-performance signal transfer throughout the range. The double-row interstitial solder cup feature also increases the level of connection durability, while the spring-loaded contacts provide a more secure and reliable connection. Finally, the component meets industry standard water, dust, and shock resistance level requirements.

Overall, the 55737-001 is one of the most reliable rectangular connector array, edge type, mezzanine (board-to-board) components on the market. Its unique frame design and spring-loaded contacts provide high-speed connections, as well as enhanced durability and reliability. The component also meets industry standard water, dust, and shock resistance requirements. This makes it ideal for a wide array of applications, including those in consumer electronics, medical devices, automotive applications, industrial applications, and more.

The specific data is subject to PDF, and the above content is for reference

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