Allicdata Part #: | HS381-ND |
Manufacturer Part#: |
566010B02800G |
Price: | $ 1.28 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | HEATSINK TO-220 CLIP-ON W/TABS |
More Detail: | Heat Sink Multiwatt, SIP Aluminum 2.0W @ 30°C Boar... |
DataSheet: | 566010B02800G Datasheet/PDF |
Quantity: | 1000 |
4000 +: | $ 1.15315 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | Multiwatt, SIP |
Attachment Method: | Clip and Board Locks |
Shape: | Rectangular, Fins |
Length: | 1.220" (30.99mm) |
Width: | 1.000" (25.40mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | 2.0W @ 30°C |
Thermal Resistance @ Forced Air Flow: | 5.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 11.50°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management systems have long been a cost-effective and simple means of cooling and problems such as overheating due to a system’s operating temperature becoming too high. The 566010B02800G is a thermal-heat sink that helps regulate temperatures in electrical and electronic systems by dissipating heat away from the point of origin. This type of system helps regulate the overall temperature of a system without the use of bulky external cooling units.
The 566010B02800G is composed of a base and a top plate, which are connected together through two corner posts. Inside the base plate is a network of fins and channels that help draw heat away from the source and dissipate it into the surrounding environment. The top plate of the 566010B02800G contains a number of small holes through which air can freely enter and exit the sink. The air helps transport the heat generated from the system’s components, such as processors and memory chips, away from the source and to the environment outside the system.
The primary function of the 566010B02800G thermal-heat sink is to reduce the operating temperature of a system’s components. When a system’s components work too hard, they can generate a large amount of heat that must be removed in order for the components to continue to function correctly. This is where the 566010B02800G comes in. By removing the heat from the processor or chips, the temperature is allowed to normalize and the components can function correctly. This helps the system work cleanly, efficiently, and remain stable.
The 566010B02800G thermal-heat sink is often used in a variety of applications, including computers, servers, telecommunications systems, consumer electronics, and automotive and aerospace applications. It is also used in applications such as medical devices and home appliances, where accurate temperature control is critical. With its ability to dissipate heat quickly and accurately, the 566010B02800G is a popular choice for these applications.
The 566010B02800G thermal-heat sink works on the principle of convection-cooling. Convection-cooling involves the movement of heat away from a surface due to the transfer of warm air caused by either an increase in temperature or the presence of a cooler body. This transfer of heat is known as thermal convection and is the most efficient means of cooling from the 566010B02800G due to its capability to move heat away from its source. The fins of the sink are designed to maximize the surface area of the heat sink, thus allowing more air to circulate and effectively dissipate heat across a larger area.
The 566010B02800G thermal-heat sink provides a low-cost and effective solution for the regulation of temperature in electronic systems and components. Its ability to remove heat quickly and accurately helps keep system components functioning at optimal levels while also helping conserve energy and reduce maintenance and repair costs. It is an effective cooling solution for a variety of applications and is an ideal choice for applications that require precise temperature control.
The specific data is subject to PDF, and the above content is for reference
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