| Allicdata Part #: | 345-1585-ND |
| Manufacturer Part#: |
567-24AB |
| Price: | $ 2.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | 1/8 BRICK HEATSINK 55X20.7X6.1MM |
| More Detail: | Heat Sink Eighth Brick DC/DC Converter Top Mount |
| DataSheet: |  567-24AB Datasheet/PDF |
| Quantity: | 473 |
| 1 +: | $ 1.95930 |
| 10 +: | $ 1.90701 |
| 25 +: | $ 1.85548 |
| 50 +: | $ 1.75241 |
| 100 +: | $ 1.64928 |
| 250 +: | $ 1.54622 |
| 500 +: | $ 1.49468 |
| 1000 +: | $ 1.34004 |
| Series: | 567 |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Eighth Brick DC/DC Converter |
| Attachment Method: | Bolt On |
| Shape: | Rectangular, Fins |
| Length: | 2.165" (55.00mm) |
| Width: | 0.815" (20.70mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.240" (6.10mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.20°C/W @ 300 LFM |
| Thermal Resistance @ Natural: | 7.20°C/W |
| Material: | -- |
| Material Finish: | Unfinished |
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Thermal - Heat Sinks
Heat sinks are devices that are designed to dissipate heat generated by electronic components such as processors and transistors. A 567-24AB thermal-heat sink, is a type of device designed to use a combination of physical and thermal conduction to dissipate heat. It is a flat metal component that contains a number of fins to increase its surface area and provide maximum cooling.
The 567-24AB thermal-heat sink works on the principle of convection cooling. Heat is generated by the components, then transferred to the fins or pins of the device which have a larger surface area. This allows the heat to dissipate more quickly into the surrounding air. The fins also serve to increase the rate at which air flows over the device, further aiding heat dissipation. The 567-24AB thermal-heat sink can also be used in conjunction with air cooling fans or water cooling systems to increase the efficiency of cooling.
The 567-24AB thermal-heat sink is used in a variety of applications, such as computers, cell phones, DVD players and other electronic devices. It is a reliable and cost-effective way to dissipate heat and prevent components from overheating. The device is ideal for situations where air flow is limited and other cooling solutions are not feasible. It is also compact and easy to install.
The 567-24AB thermal-heat sink is a cost-effective and reliable solution for dissipating heat from electronic components. It works by using convection cooling to efficiently transfer heat away from the components. This prevents components from overheating and helps to improve the lifespan of the device. The device is suitable for a variety of applications and is compact and easy to install.
The specific data is subject to PDF, and the above content is for reference