Allicdata Part #: | 926-1036-ND |
Manufacturer Part#: |
56890-503 |
Price: | $ 16.19 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Laird Technologies - Engineered Thermal Solutions |
Short Description: | PELTIER MOD CP14,71,045,L1,W4.5 |
More Detail: | Peltier Module 29.72mm x 29.72mm x 3.33mm 41.3W @ ... |
DataSheet: | 56890-503 Datasheet/PDF |
Quantity: | 64 |
1 +: | $ 14.71680 |
10 +: | $ 13.47190 |
25 +: | $ 13.05610 |
Specifications
Series: | CP |
Part Status: | Active |
Outline L x W x H: | 29.72mm x 29.72mm x 3.33mm |
Qmax @ Th: | 41.3W @ 25°C |
Delta Tmax @ Th: | 67°C @ 25°C |
Current - Max: | 8.5A |
Voltage - Max: | 8.0V |
Resistance: | 870 mOhms |
Operating Temperature: | 80°C |
Features: | Lead Wires, Non-Sealed |
Description
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Thermal - Thermoelectric, Peltier Modules
Thermoelectric, Peltier modules, or TEMs, are devices that use the Peltier effect to transfer heat from one side of a module to the other. The Peltier effect occurs when an electric current passes through a junction between two different metals, and heat is transferred from one side of the device to the other.Peltier modules are used in a variety of applications, ranging from cooling and heating small electronic components, to providing refrigeration and air conditioning for larger equipment. In particular, 56890-503 Peltier modules are popular for their ability to efficiently move heat while providing a small, efficient size.Peltier modules are composed of two different components. The first component is the Peltier junction, which is a junction between two different metals that is used to transfer heat. A common configuration uses two sets of copper plates on either side of a semiconductor substrate, with the metal contacts connected to a series of reflow soldering pads.The second component of the module is the heat sink, which is used to conduct heat away from the junction. Heat sinks are typically made of lightweight aluminum alloy or copper, and are affixed to the module with thermally conductive epoxy.The working principles behind the Peltier module are relatively simple. When an electric current is applied to the semiconductor substrate, electrons flow through the junction and create a voltage difference between the two sides of the module. This voltage difference causes the metals to heat or cool, depending on the temperature of the semiconductor substrate.As the metals heat or cool, the heat is transferred from one side of the module to the other, which allows for the efficient transfer of thermal energy. The design of Peltier modules allows them to be very efficient—far more efficient than conventional air conditioning or refrigeration systems.The 56890-503 Peltier module is an efficient, compact device that can provide a great deal of thermal energy transfer. It is available in several different sizes, and can be used to cool or heat a variety of different components and systems. Additionally, the 56890-503 Peltier modules are commonly used in systems that require extended cooling or heating, due to their efficiency and reliable performance.Peltier modules are an efficient, cost-effective way to move thermal energy. They are used in a variety of industrial and commercial applications, and can provide a great deal of effective cooling or heating capability. The 56890-503 module, in particular, is a very efficient device that provides reliable long-term performance.The specific data is subject to PDF, and the above content is for reference
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