574502B03700G

Heat sinks, also called thermal sinks, are hardware components used to dissipate heat away from electronics and components. 574502B03700G is a thermal-heat sink designed with specific application fields and working principle in mind.

The 574502B03700G thermal-heat sink is primarily designed for use in data storage and server related electronic and computing hardware devices. This heat sink is made from AL6063-T5 aluminum alloy, and its surface treatment is anodic oxidation. Its overall dimensions are 57.45mm x 50.2mm x 37.0mm.

The thermal-heat sink also features three 6mm-high heat column through-holes to firmly attach to the corresponding series of required components. It also utilizes four 6.5 x 3.2mm tangent ceramic inserts to attach tightly and securely to the components for maximum stability and efficiency.

The working principle of 574502B03700G thermal-heat sink is that heat generated by electronic components is transferred to the heat sink’s aluminum plate. The aluminum plate then radiates and convects the heat away quickly and evenly to the atmosphere surrounding it. The aluminum alloy material used in the heat sink has superior thermal conductivity, which helps the heat sink to more efficiently dissipate the heat away.

The 574502B03700G thermal-heat sink is an ideal hardware solution for any computing device or other electronic device that generates excess heat. Its stable and secure construction makes it easy to install, while its efficient heat dissipation properties make it the perfect choice for rapid heat dissipation. Whether it is used to cool processors, hard drives, or memory, its superior design and construction ensures maximum cooling performance.