Allicdata Part #: | 574802B03300G-ND |
Manufacturer Part#: |
574802B03300G |
Price: | $ 0.65 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-220 Aluminum 3.0W @ 60°C Board Level,... |
DataSheet: | 574802B03300G Datasheet/PDF |
Quantity: | 1000 |
8000 +: | $ 0.58429 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | Clip and PC Pin |
Shape: | Rectangular, Fins |
Length: | 0.900" (22.86mm) |
Width: | 1.020" (25.91mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.420" (10.67mm) |
Power Dissipation @ Temperature Rise: | 3.0W @ 60°C |
Thermal Resistance @ Forced Air Flow: | 6.00°C/W @ 500 LFM |
Thermal Resistance @ Natural: | 20.40°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal - Heat Sinks
The 574802B03300G is a heat sink that is used to efficiently dissipate heat and transfer thermal energy from one component to another. It is commonly used in high-performance computer systems, as well as in electrical and electronic devices. The device is designed to provide reliable and effective thermal dissipation of energy from an electronic component.
The 574802B03300G heat sink utilizes a unique combination of components to provide superior heat dissipation. The device utilizes a base plate made of aluminum, with fins that are lined with copper. This combination of materials helps to dissipate heat more efficiently than other materials that are commonly used in heat sinks. Additionally, the fins are designed in a way to allow air to freely pass between them, which helps to facilitate efficient heat dissipation.
The 574802B03300G also utilizes thermal conductive paste or grease to ensure effective heat transfer between components. This paste helps to reduce possible contact resistance between the components, which helps to improve thermal performance. The paste also helps to maintain the surface temperature of the fins, which further increases the efficiency of the heat transfer.
The 574802B03300G heat sink also utilizes a unique fan design to further increase the thermal performance of the unit. The devices utilize a high-efficiency fan that is designed to provide optimal airflow between the fins and the heat source. Additionally, the fan is designed to redirect the air flow to the center of the unit, where the heat is most efficiently lowed.
In sum, the 574802B03300G is an efficient heat sink that is designed to provide superior heat transfer and thermal dissipation between components. The device utilizes materials and designs to ensure optimal thermal performance, and is commonly used in high-performance computer systems, as well as in electrical and electronic devices. The device also utilizes thermal paste and a unique fan design to further enhance thermal transfer and dissipation. As such, the 574802B03300G is an ideal choice for thermal dissipation applications.
The specific data is subject to PDF, and the above content is for reference
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