574902B04300G

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	Clip and PC Pin
Shape:	Rectangular, Fins
Length:	1.375" (34.93mm)
Width:	0.860" (21.84mm)
Diameter:	--
Height Off Base (Height of Fin):	0.395" (10.03mm)
Power Dissipation @ Temperature Rise:	2.5W @ 40°C
Thermal Resistance @ Forced Air Flow:	6.00°C/W @ 400 LFM
Thermal Resistance @ Natural:	16.00°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal – Heat Sinks

Thermal-Heat Sink is one of the most important components in the system that is designed to dissipate the heat generated by electronic components like processors, graphics cards, memory, and storage devices. 574902B04300G is a thermal-heat sink that has a long service life and superior performance.

Applications

The 574902B04300G is a thermal-heat sink that is designed to enable heat transfer from CPUs and GPUs in laptops, desktops, servers, workstations, and other electronic devices. It can also provide heat dissipation for the storage devices in these systems. Furthermore, the heat sink is applicable for any other system that require efficient heat transfer and dissipation. Moreover, it is an ideal choice for high-performance gaming computers and other systems that require heavy load computing.

Construction and Design

The 574902B04300G thermal-heat sink is constructed with an aluminium heatsink fin structure, and the heat transfer between the heat sources and its fins is achieved by heat pipe technology. It offers excellent thermal performance and ensures low voltage drop across its fins.It is designed to provide superior heat dissipation performance by allowing efficient heat transfer. Its fins are strategically curved to ensure a balanced airflow which circulates perfectly throughout the entire heatsink to draw out heat from the components.

Work Principle

The 574902B04300G thermal-heat sink works on the principle of thermoelectricity. Heat is absorbed from the processor or another hot electronic component by the heat pipe, and transferred to the fins of the heat sink, where the heat is dissipated in the environment. This process is repeated until the heatsink reaches a stable temperature.The heat sink utilizes its fin structure to improve its efficiency in cooling and dissipating heat. Heat dissipates much faster when it is spread out into a larger area, as compared to when it is kept in a small space. The fins increase the area in which the heat is dissipated, allowing for faster cooling and more efficient operation.

Key Features

The 574902B04300G thermal-heat sink features a wide range of advantages such as improved cooling performance, low voltage drop, and superior durability. It is also designed to be lightweight and has an elegant aesthetic.The 574902B04300G thermal-heat sink has numerous features which make it ideal for high performance gaming computers. Its compact size makes it easy to install, and its long service life assures no premature failure or damage. Additionally, this heat sink is resistant to impact, vibration, and corrosion, making it a reliable and durable choice for several applications.

Conclusion

The 574902B04300G thermal-heat sink is one of the best thermal management solutions available. It provides an effective heat transfer and dissipation system while remaining lightweight and aesthetically pleasing. In addition, its superior durability and low voltage drop make it the perfect choice for high performance gaming computers and other heavy loads applications.

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