581002B02100G

Thermal - Heat Sinks

581002B02100G is a typical thermal solution used in many industries, mainly serving to extend the working lifespan of a electrical device by dissipating the heat generated from its operation. Its application field covers a wide variety, from automotive electronics to industrial automation, from laptop to server systems, all require thermal solution for their operstion.

Working Principle

Heat sinks come in various sizes and designs. Mass produced units usually use extruded aluminum fin-and-base construction, where the base is a piece of thin metal plate with a small area, used to attach the heat sink to a circuit board, while the fin is a piece of metal folded in a parallel pattern, forming a vairety of creases, used to dissipate the heat away from the circuit board. Heat is conducted through the base of the heat sink from the electrical component, and then dissipates into the atmosphere through the fins. The shape and number of the fins can be adjusted, allowing for different heat output ratios for different applications.

Reflow Soldering

The 581002B02100G is designed to handle large amounts of heat, typically up to 200W. It is also engineered for a reliable attachment to the device it is cooling, requiring solder reflow. This type of soldering method is the process of melting solder on the metal surface of the heat sink in order to attach it to a component. Reflow soldering is used in various applications, such as the production of printed circuit boards, electronic device repairs and assembly crafts.

High Quality Construction and Performance

The 581002B02100G features a high quality construction, using heat resistant aluminum and precision machined to extremely tight tolerances for precise fit and performance when placed on a device. It has a base design which ensures a secure thermal bond while allowing for its thinner body design.In addition, its thermal performance is also superior, providing reliable thermal transfer from component to atmosphere. It has a built in thermal gap filler that filled the small gaps between the aluminum fin and base, which helps boost its performance. Furthermore, its two-step mounting process ensures a secure fit between the heatsink and the component, offering a reliable thermal performance for a long-time operation, which can extend the life of the device.

Conclusion

The 581002B02100G is a thermal solution designed for many applications in which reliable and efficient cooling is required. Its metal construction design ensures high quality construction, precision fit and reliable performance. Its high thermal performance with its built-in thermal gap filler helps in extending the working lifespan of a electrical device by dissipating the heat generated from its operation. With its easy attachment by reflow soldering, this type of thermal solution is the perfect choice for any type of application.