5821997-3 Allicdata Electronics

5821997-3 Connectors, Interconnects

Allicdata Part #:

A114048-ND

Manufacturer Part#:

5821997-3

Price: $ 7.36
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN SKT SIMM 72POS PCB
More Detail: 72 Position SIMM RAM Socket Through Hole
DataSheet: 5821997-3 datasheet5821997-3 Datasheet/PDF
Quantity: 130
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: $ 6.69690
10 +: $ 6.40332
25 +: $ 5.82120
50 +: $ 5.53014
100 +: $ 5.38461
250 +: $ 4.80249
500 +: $ 4.51143
1000 +: $ 3.98752
Stock 130Can Ship Immediately
$ 7.36
Specifications
Series: Micro-Edge
Packaging: Tube 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Style: SIMM
Number of Positions: 72
Memory Type: RAM
Standards: MO-116
Mounting Type: Through Hole
Features: Board Guide, Latches
Mounting Feature: Normal, Standard - Top
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Description

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Memory Connectors - Inline Module Sockets: 5821997-3 Application Field and Working Principle

Inline Module Sockets allow multiple flexible connections between external interfaces and a computer\'s components, providing a physical connection between them. These connectors can be used in various applications, such as data transport and communication applications. In particular, the 5821997-3 Inline Module Socket is frequently used in memory modules and electronic equipment, allowing designers to easily design and implement complex logic and memory circuits.The 5821997-3 Inline Module Socket is primarily used to connect memory modules into a computer system. They are particularly useful when the memory module must be replaced. With this type of connector, the memory module can be quickly swapped out without disrupting other components. Because this type of connector is designed to be low profile, it fits into slim and small form factors. Furthermore, their low insertion forces allow them to be used in high-density environments where a connector with a higher insertion force may damage the components.The working principle of 5821997-3 Inline Module Socket is relatively straightforward. It is composed of an Inline Module Socket and a Memory Module Interface. When connected, the Inline Module Socket provides electrical continuity and power from the Memory Module Interface to the computer system. The Spring Loaded Contact of the Inline Module Socket provides mechanical maintenance, providing a secure connection while allowing movement within the connector. Furthermore, the retention clip on the connector ensures a secure physical connection between the connectors. Additionally, the 5821997-3 Inline Module Socket provides a high level of reliability. With its pressure contact construction, it ensures a reliable electrical connection and minimal variation from contact to contact. Furthermore, it has a high rated current, allowing it to easily power memory modules. These features make the 5821997-3 Inline Module Socket the preferred choice for a wide range of memory module applications. Moreover, the 5821997-3 Inline Module Socket is equipped with a variety of features to enhance its compatibility and usability. It has flexible row and column numbers, allowing it to be used in a wide range of applications. Furthermore, its keyed construction makes it impossible to insert a module into the wrong place, improving safety and reducing any risk of electromagnetic interference. Finally, it is intermateable and accepts a range of signal voltages, from 3.3V to 9V. In conclusion, the 5821997-3 Inline Module Socket is an ideal choice for connecting memory modules to a computer system. Its low profile makes it suitable for high-density applications in slim form factors, while its flexible design, high rated current, and reliable electrical connection make it a reliable choice. Furthermore, its keyed construction, intermateability, and signal voltage tolerance make it an excellent choice for a wide variety of memory module applications.

The specific data is subject to PDF, and the above content is for reference

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