58335-101LF Allicdata Electronics

58335-101LF Connectors, Interconnects

Allicdata Part #:

58335-101LF-ND

Manufacturer Part#:

58335-101LF

Price: $ 0.41
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: METRAL HDR 4RX1M SIG
More Detail: N/A
DataSheet: 58335-101LF datasheet58335-101LF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1920 +: $ 0.37488
Stock 1000Can Ship Immediately
$ 0.41
Specifications
Series: Metral®
Packaging: Tube 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Header, Male Pins
Connector Style: --
Number of Positions: 30
Number of Positions Loaded: --
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Columns: 6
Mounting Type: Through Hole
Termination: Press-Fit
Contact Layout, Typical: --
Features: --
Contact Finish: --
Contact Finish Thickness: --
Color: --
Current Rating: --
Material Flammability Rating: UL94 V-0
Operating Temperature: --
Voltage Rating: --
Description

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Backplane Connectors – Specialized

The use of backplane connectors has become increasingly commonplace in most industrial and technical applications as the demand for reliable and consistent electrical interconnection is paramount in today’s industry. Specialized backplane connectors, such as the 58335-101LF, provide additional features that enhance the reliable and consistent delivery of power and signal transmission within the confines of a single assembly.

The 58335-101LF is a specialized connector designed for high-speed and high-noise immunity applications. It is capable of carrying low-voltage signals and high-current power while providing exceptional performance and transmission quality. The 58335-101LF is capable of withstanding shock and vibration while providing signal transmission integrity that exceeds industry standards.

The connector is constructed with an insulated substrate which has a card edge that is designed to mate with a card edge motherboard. This card edge provides a secure and reliable connection while also facilitating a robust transmission of signals. The substrate is also designed to reduce noise sensitivity by providing an inner layer of insulation. This inner layer also helps to protect against any interference from other components on the level of the board.

At the heart of the 58335-101LF backplane connector is its design which utilizes a 1mm pitch design. This design minimizes three key factors: cross talk, electromagnetic interference, and board-to-board skew. Additionally, the 1mm pitch connectors also provide a higher number of I/O pins, allowing for greater flexibility and scalability.

The 58335-101LF is available with a variety of contact configurations, including soldering pins, spring-loaded contacts, and gold-plated surfaces. The various contact types enable high-quality connections to ensure reliable and consistent power and signal transmission. This helps to eliminate the potential for errors that can be caused by insufficient contact between components. Additionally, the gold plating also facilitates better thermal and temperature management during extended periods of use.

In addition to the high-quality connection, the 58335-101LF offers versatility in its application field. This makes it suitable for a wide range of applications, including consumer electronics, medical devices, automotive, industrial, communications, and audio and video products. The connector also meets rigorous standards for electrical and environmental compatibility, ensuring safety while providing reliable performance.

The 58335-101LF is a specialized backplane connector that offers superior performance and reliability in power and signal transmission. It is designed to offer maximum flexibility and scalability while providing a robust connection that is resistant to vibration and shock. The connector is available with a variety of contact configurations and provides high-quality connections for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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