591202B03100G Allicdata Electronics
Allicdata Part #:

591202B03100G-ND

Manufacturer Part#:

591202B03100G

Price: $ 0.30
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: BOARD LEVEL HEAT SINK
More Detail: Heat Sink TO-220, TO-262 Aluminum 1.0W @ 40°C Boar...
DataSheet: 591202B03100G datasheet591202B03100G Datasheet/PDF
Quantity: 1000
10000 +: $ 0.27109
Stock 1000Can Ship Immediately
$ 0.3
Specifications
Series: --
Part Status: Active
Type: Board Level
Package Cooled: TO-220, TO-262
Attachment Method: Clip and PC Pin
Shape: Rectangular, Fins
Length: 0.600" (15.24mm)
Width: 0.500" (12.70mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 26.80°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

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Thermal - Heat Sinks have been essential for electronic systems ever since the invention of the vacuum tube. To ensure the performance of an electronic system, it is essential to manage and regulate its temperature. Otherwise, the system will inevitably be affected by heat related issues, such as poor performance, decreased life span, and even complete failure. Heat sinks are thus extensively used to transfer and dissipate heat away from electronic components by taking advantage of natural or forced air convection.

The 591202B03100G is a thermal-heat sink. The heat sink is designed with a flat profile for soldering to printed circuit boards in systems that have high power densities. It is constructed with an aluminum heat sink body with a black anodized finish and fits and dissipates up to 50W of energy. The thermal heat sink has a maximum temperature of 85° C with a voltage rating of 250V.

In operation, the thermal heat sink works by transferring the energy from the electronic component that is mounted to the aluminum body and dispersing it in the ambient air. This is done by taking advantage of either natural or forced convection. Natural convection circulates the air around the device while forced convection allows heat to be transferred over greater distances by fans or pumps. In order to achieve the desired level of cooling, it is important that the device is designed to take full advantage of the two convection methods.

The 591202B03100G utilizes a combination of natural and forced convection for optimal cooling. The anodized aluminum body of the device effectively absorbs heat during operation and distributes it to the surrounding air. In order to further regulate the temperature, the heat sink is outfitted with a fan for forced convection. The fan ensures that the air is constantly circulated around the device, providing additional heat dissipation. This allows the device to maintain its optimal temperature rating, even when exposed to high power densities.

The 591202B03100G is an effective solution for managing the high power densities present in electronic systems. It is highly efficient in dissipating heat and maintaining optimal temperature levels, and ensures that the system is able to function properly and safely. As such, the use of thermal-heat sinks, such as the 591202B03100G, are essential for the performance of electronic systems.

The specific data is subject to PDF, and the above content is for reference

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