6-6-1181

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RF and electromagnetic interference (RF/EMI) noise and radiated emissions are very common problems in both the commercial and consumer electronics application fields and in many other industrial processes. Shielding and absorbing materials are very effective means of reducing this type of interference, while still allowing for a sufficient level of signal transmission. The 6-6-1181 RF and EMI-shielding and absorbing materials are designed to provide a reliable and effective solution to control and reduce the negative impacts of RF/EMI effects.

The 6-6-1181 RF/EMI-shielding and absorbing materials are designed to be used in a wide variety of applications, such as commercial communication devices, consumer electronics, wireless equipment, and industrial and medical applications. These materials are specifically designed to reduce the noise and rf interference and are commonly used in applications where expense or space limitations may not allow the full utilization of traditional shielding technology.

These materials provide excellent performance in the frequency ranges of 450 MHz to 8,000 MHz (3G and 4G wireless) and also complement existing shielding structures. The shielding and absorbing materials are typically available in thicknesses ranging from 6 mm (.25”) to 12 mm (.5”), depending on the application. These materials can also be customized in order to meet the specialized needs of any application.

The 6-6-1181 RF/EMI-shielding and absorbing materials are designed to be very efficient in providing an effective and reliable solution to reduce RF/EMI interference. The material\'s effectiveness increases with the increased width of the shielding surface. The material is also designed to have a high conductivity and a low dielectric constant. This allows for the material to reduce noise and rf interference in both short and long range applications, while maintaining the signal characteristics.

The 6-6-1181 RF/EMI-shielding and absorbing material works by providing an additional “layer” between the device or circuit board and the environment. This layer provides an effective barrier which effectively dissipates and reduces the RF energy (EMI/RFI) interference to the device or circuit board. This is done by providing a shield between the source of EMI (electromagnetic interference) and the device or circuit board. This shield will reduce the EMI energy from reaching the device or circuit board directly, and instead force the EMI energy to dissipate as it is reflected off the device or circuit board.

The shielding and absorbing material also works by absorbing or dissipating the EMI energy, which in turn reduces the undesired signal propagation. As the amount of energy impinging on the device or circuit board is reduced, this in turn results in a lower level of RF/EMI interference. The materials are designed to reduce the interference to a level where it is no longer disruptive to the system, and no longer poses any risk to the performance or reliability of the system.

Additionally, the 6-6-1181 RF/EMI-shielding and absorbing materials are designed to have a relatively high temperature tolerance, which allows them to be used in a wide range of high-temperature applications. The materials are also designed to be relatively light-weight, providing further benefits in terms of ease of installation. Finally, the material is designed to be highly flexible and able to conform to a variety of different shapes and surfaces, making it ideal for applications requiring an easy and reliable solution for controlling EMI/RFI interference.

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