624-25ABT1E Allicdata Electronics
Allicdata Part #:

624-25ABT1E-ND

Manufacturer Part#:

624-25ABT1E

Price: $ 0.81
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK FOR 21MM BGA
More Detail: Heat Sink
DataSheet: 624-25ABT1E datasheet624-25ABT1E Datasheet/PDF
Quantity: 1000
2000 +: $ 0.72157
Stock 1000Can Ship Immediately
$ 0.81
Specifications
Series: *
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat Sinks are devices used to absorb and dissipate heat produced by electronic components, such as CPUs, GPUs, RAM, hard drives, and other components. The 624-25ABT1E thermal heat sink is a great choice for cooling components that generate high amounts of heat. It uses a combination of a solid copper base, four aluminum extruded fins, and several thin copper fins to ensure effective heat dissipation.

624-25ABT1E Heat Sink Application Field

The 624-25ABT1E heat sink is used in various applications that require the dissipation of large amounts of heat, such as power supplies, LED lighting applications, and cooling high performance components. It is also used in cases where larger heat dissipation is needed, such as in gaming PCs that are designed to run high intensity games and 3D applications. It is also used in industrial applications, such as production equipment and large electrical servos, where reliable and efficient cooling is needed.

624-25ABT1E Heat Sink Working Principle

The 624-25ABT1E heat sink works by convection. The solid copper base and the four aluminum extruded fins allow for a high rate of heat dissipation. The thin copper fins are used to increase surface area, exposing more of the base and aluminum fins to the air, increasing the amount of heat that can be dissipated. The heat sink also utilizes thermal paste, such as an aluminum-based thermal paste, to ensure better heat transfer from the component to the surface of the heat sink. During operation, the heat generated by the component is absorbed by the aluminum fins, while at the same time the thermal paste ensures that heat is quickly and efficiently transferred to the temperature fins. The copper fins also absorb and dissipate the heat from the air surrounding the heat sink, cooling down the component even further.Heat sinks are widely used in a variety of applications because of their efficient cooling capabilities. The 624-25ABT1E heat sink is a great choice for cooling components that generate a large amount of heat, such as GPUs and high performance processors. It is also an excellent choice for industrial applications, such as production equipment and larger servos, where more efficient cooling is needed.

The specific data is subject to PDF, and the above content is for reference

Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics