Allicdata Part #: | 345-1059-ND |
Manufacturer Part#: |
624-25ABT4 |
Price: | $ 0.00 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | HEATSINK CPU 21MM SQ W/DBL TAPE |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | 624-25ABT4 Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | 624 |
Part Status: | Obsolete |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins |
Length: | 0.827" (21.00mm) |
Width: | 0.827" (21.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.250" (6.35mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 25.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal management plays an important role in many electrical powered units and devices. Heat sinks with sophisticated designs are used to dissipate heat quickly and efficiently so the units and products have an extended life. 624-25ABT4 is an excellent example of a thermally managed heat sink.
The 624-25ABT4 is a single sided heat sink made from aluminum with a black anodized top surface. This heat sink uses a patented base and fin design to provide superior cooling performance. The design ensures maximum contact between the aluminum base and the component that is mounted to it, and the fin design dramatically increases the surface area for better cooling. The combination of the base and the fins provide excellent thermal conductivity which helps to dissipate heat quickly.
This heat sink excels in several application fields, such as computers, electronic components, home appliances, and automotive components. It is especially effective when used with high-power components such as processors, power transistors, amplifiers, and LEDs. The design also makes the 624-25ABT4 an effective choice for cooling applications in telecommunication, scientific and medical equipment.
The 624-25ABT4 has an efficient 2-phase heat transfer process. Heat from the components is conducted to the aluminum base where it is then dissipated to the air using the fins. This 2-phase process helps to quickly dissipate the heat and keep temperatures low. The high performance design makes it suitable for cooling components in high temperature environments and helps to extend the life of electronic devices.
The patented design of the 624-25ABT4 helps to maintain a low profile design which makes it an excellent choice for working in space-constrained applications. It also provides increased resistance to vibration which is important in many commercial applications. In addition, the aluminum material is lightweight and very easy to work with.
The 624-25ABT4 is an excellent example of how heat sinks can incorporate sophisticated designs to achieve efficient thermal management in different application fields. Its base and fins enable it to quickly and effectively dissipate heat and the low profile design makes it suitable for space-constrained applications. The design also increases resistance to vibration which makes it suitable for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference