624-45ABT1E Fans, Thermal Management |
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Allicdata Part #: | 624-45ABT1E-ND |
Manufacturer Part#: |
624-45ABT1E |
Price: | $ 0.89 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | HEATSINK FOR 21MM BGA |
More Detail: | Heat Sink |
DataSheet: | 624-45ABT1E Datasheet/PDF |
Quantity: | 1000 |
1600 +: | $ 0.80174 |
Series: | * |
Part Status: | Active |
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Thermal heat sinks are devices designed to cool hot components and will also help keep them from overheating. These devices can be used in many applications, such as computer processors, graphics cards, power supplies, and other high-power components. The 624-45ABT1E is an example of a thermal heat sink that is designed to cool these components and protect them from damage.
The main purpose of a heat sink is to dissipate heat away from the component. The 624-45ABT1E accomplishes this by using fins to increase the surface area of the heat sink. This finned design allows for more air circulation and more efficient cooling. Additionally, the fins are constructed with a special thermal material that helps dissipate heat away from the component and cool it down.
As with any thermal device, performance is key. The 624-45ABT1E provides excellent performance, thanks to its specially designed fins, thermal material construction, and effective fan attachment system. The fan attachment system ensures the fan is securely connected and can provide optimal cooling. Additionally, this model comes equipped with copper heat pipes to further improve heat dissipation, allowing for better thermal performance.
In terms of applications, the 624-45ABT1E is primarily used to cool high-power components. It is ideal for cooling processors, graphics cards, power supplies, and other types of components. The heat sink is compatible with several motherboard and processor models, allowing it to be used in a variety of systems. Additionally, it is also compatible with various cooling fans, allowing users to customize their cooling system and obtain optimal performance.
The 624-45ABT1E has a unique working principle, which enables it to effectively dissipate heat away from the component. Rather than dissipating the heat to the atmosphere, it instead transfers the heat from one component to another. This process is referred to as "heat piping" and was developed by several engineers in the early 2000s. In heat piping, the heat from a component is transferred to another component through copper pipes. This process helps ensure the heat is efficiently dissipated away from the component and the surrounding environment.
Overall, the 624-45ABT1E is a great choice for cooling high-power components and protecting them from damage caused by overheating. It is designed with special fins to improve air circulation, continuously dissipates heat away from the component through its thermal material, and utilizes copper heat pipes to transfer heat away from the component. Additionally, it is compatible with several motherboard and processor models, and allows for user customization with cooling fans.
The specific data is subject to PDF, and the above content is for reference