| Allicdata Part #: | 625-25AB-ND |
| Manufacturer Part#: |
625-25AB |
| Price: | $ 0.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK FOR 25MM BGA |
| More Detail: | Heat Sink |
| DataSheet: |  625-25AB Datasheet/PDF |
| Quantity: | 1000 |
| 1100 +: | $ 0.58794 |
Specifications
| Series: | * |
| Part Status: | Active |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
625-25AB is a type of commercial heat sink. This type of sink is designed to cool electronics rapidly by transferring heat away from the components. Heat sinks work by transferring thermal energy away from their surface and cooling their core temperature.
This article will be discussing the application field and working principle of 625-25AB heat sinks.
This article will be discussing the application field and working principle of 625-25AB heat sinks.
Application Field
625-25AB heat sinks are designed to be used in various types of electronic devices. They are perfect for cooling processors, switchgear, rectifiers, transformers, inverters, and driver boards. This type of sink has been proven to provide an efficient and reliable cooling solution for all types of commercial electronics.In addition to cooling electronics, 625-25AB heat sinks can also be used to protect circuits from thermal damage. Heat sinks can be used to reduce the temperature of overheating components and increase the lifespan of electronics. This type of sink is also perfect for protecting sensitive components from damage due to excessive heat.
Working Principle
The working principle of 625-25AB heat sinks is fairly simple. This type of sink is designed to transfer the thermal energy away from the component and dissipate it into the surrounding air. Heat sinks are made up of a series of fins connected to a base that is attached to the component, as well as a fan that provides airflow to aid in the cooling process.When the component generates heat, the heat is transferred to the base of the heat sink where it is dissipated into the surrounding air. The air then passes through the fins of the heat sink which further dissipates the thermal energy. This process results in the component being cooled without the need for additional cooling methods such as water cooling.
As the air passes through the fins of the heat sink, the thermal energy is dissipated in a variety of ways. While some of the energy is dissipated through convection, the majority of it is absorbed by the fins which act as a form of heat sink material. This material absorbs the thermal energy and converts it to electricity which is then dissipated into the surrounding air.
In some cases, the 625-25AB heat sink will be used in conjunction with other cooling methods such as fans or water cooling. When this is the case, the fan or water cooling will help to dissipate the thermal energy even further. This helps to ensure that the component is cooled to its optimal temperature level.
In conclusion, 625-25AB heat sinks are used in a wide variety of commercial electronics applications. This type of sink is designed to transfer thermal energy away from a component and dissipate it into the surrounding air for secure cooling. The working principle of 625-25AB heat sinks includes transferring the thermal energy away from the component and using fins and fans to further dissipate the heat. This process results in the component being cooled without the need for additional cooling methods such as water cooling.
The specific data is subject to PDF, and the above content is for reference
Latest Products