625-60AB Allicdata Electronics
Allicdata Part #:

625-60AB-ND

Manufacturer Part#:

625-60AB

Price: $ 0.77
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK FOR 25MM BGA
More Detail: Heat Sink
DataSheet: 625-60AB datasheet625-60AB Datasheet/PDF
Quantity: 1000
1600 +: $ 0.69484
Stock 1000Can Ship Immediately
$ 0.77
Specifications
Series: *
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are a form of dissipating thermal energy from electronics, allowing them to work efficiently and evenly. Heat sinks come in many different shapes and sizes, and one of the most common is the 625-60AB. This specific heat sink model can be found in a variety of applications and is used for everything from cooling CPUs to powering small electronics. However, it is important to understand the working principles of the 625-60AB before attempting to use it.

The 625-60AB is a thermal dissipator that acts as a heat sink collector. It is designed specifically to absorb and then disperse the thermal energy that devices generate. It does this by conducting the heat away from the device and dissipating it onto the heat sink. The heat produced then radiates out from the heat sink through heat dissipation fin air fins, which are designed to dissipate the heat into the atmosphere.

The 625-60AB is ideal for cooling CPUs, as it has a large enough surface area to disperse the large amount of heat generated by these CPUs. Due to its large surface area, the 625-60AB is able to effectively cool CPUs with lower wattage, without putting too much stress on the CPU itself. Furthermore, the 625-60AB is also used in other applications, such as cooling graphics cards, providing constant, quiet cooling for high-performance graphics cards.

The 625-60AB can also be used to power smaller electronic devices such as Raspberry Pis and Arduino-compatible boards. By connecting the 625-60AB heat sink to the board, it can provide a steady and even stream of power to the device, allowing the device to operate without overheating.

The 625-60AB also comes in a variety of mounting types, making it easy to install and use in different environments. The most commonly used mounting type is the through-hole mount, which requires minimal space and allows the heat sink to be securely attached to the board. Additionally, the 625-60AB is also available as a surface-mount, which can be easily mounted on any flat surface and will provide reliable, consistent cooling.

The 625-60AB is a versatile heat sink that is ideally suited for a variety of applications. Whether you are cooling a CPU, powering a Raspberry Pi, or cooling a graphics card, the 625-60AB can provide reliable and efficient cooling. With its wide range of mounting options and its dependable heat dissipating properties, this heat sink is a great way to ensure your electronics perform optimally.

The specific data is subject to PDF, and the above content is for reference

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