628-25ABT1E Allicdata Electronics
Allicdata Part #:

628-25ABT1E-ND

Manufacturer Part#:

628-25ABT1E

Price: $ 1.26
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK FOR 45MM BGA
More Detail: Heat Sink
DataSheet: 628-25ABT1E datasheet628-25ABT1E Datasheet/PDF
Quantity: 1000
1000 +: $ 1.13325
Stock 1000Can Ship Immediately
$ 1.26
Specifications
Series: *
Part Status: Active
Description

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Thermal - Heat Sinks are essential components of any system due to their ability to transfer heat from one component to another. The 628-25ABT1E thermal-heat sink is a specific type of heat sink that is used to cool down active components in a digital system and make sure that the internal components are not exposed to too high of temperatures. This article will discuss the application field and working principle of the 628-25ABT1E.

The 628-25ABT1E heat sink is used in electrical and electronic devices such as computers, mobile phones, and processors. It has a small form factor making it suitable for use in small enclosures, and its low profile enables it to fit into tight spaces. Furthermore, the design of the 628-25ABT1E eliminates the need for a fan, making it more efficient and reliable. This makes it ideal for use in data centers and other high-performance applications.

The 628-25ABT1E heat sink utilises a specifically designed fin structure to deliver optimum cooling performance. The fins are arranged in a radial pattern with the base of the heat sink acting as the centre point. The fins are made from high conductivity metal, such as copper or aluminum, and have a unique geometry that optimises air flow. This helps to dissipate heat from the heat source quickly and efficiently.

The 628-25ABT1E heat sink also includes a unique clip attachment system which allows it to be easily installed in any system. The clip is securely mounted to the base of the heat sink and enables even distribution of pressure for a secure fit. This ensures that the heat sink will stay securely in place even when subjected to high vibrations or temperature fluctuations.

The working principle of the 628-25ABT1E is fairly simple. Heat is generated by active components in the system, which is then conducted through the heat sink. This heat is then dissipated away from the system by the fin structure, using convection cooling. The air flow produced through the fin structure carries away the heat from the heat source and dissipates it into the surrounding air. This helps to regulate the temperature of the system and ensure that it stays within its optimal operating parameters.

In conclusion, the 628-25ABT1E thermal-heat sink is an effective and reliable cooling solution for electrical and electronic devices. Its clip attachment system and fin structure make it ideal for use in tight spaces, and allow it to efficiently dissipate heat away from the heat source. This helps to keep active components cool and ensures that the system runs smoothly and reliably.

The specific data is subject to PDF, and the above content is for reference

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