628-25ABT5

Series:	*
Part Status:	Active

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

Thermal management is a crucial component in the operation of many types of electronic devices. Heat sinks, such as the 628-25ABT5, play an integral role in dissipating the heat generated by such devices. In this article, the 628-25ABT5 thermal-heat sink will be discussed, including its application field and working principle.

Application Field of 628-25ABT5

The 628-25ABT5, referred to as a “flower” heat sink, is an innovative thermal-heat sink designed for high-power applications like diode laser DSPs. It is compatible with high-density electrical systems, includes a low-resistance bonding pad and features a variety of options for mounting components. The 628-25ABT5 also features high heat transfer efficiency, low thermal impedance, and large surface area. All of these design features make the 628-25ABT5 ideal for applications such as power semiconductors, IGBT chipsets, and power modules for automotive electronics.

Working Principle

The 628-25ABT5 operates in a leaf-shaped “flower” design to provide continuous and uniform flow of heat away from a device. This design allows for direct contact between the device and the heat sink, resulting in better thermal management. The 628-25ABT5 is made from an aluminum alloy and utilizes a convective cooling mechanism. This mechanism uses the natural principle of convection, which is the movement of a liquid or gas caused by temperature variations. Heat is absorbed from the component and evenly dissipated by the aluminum alloy to ensure low thermal impedance. The 628-25ABT5 also has a low U-value, which measures the rate of heat transfer through a material. This feature ensures that less energy is needed to move heat out of the device and helps keep the operating temperature at a stable level.

Conclusion

The 628-25ABT5 is a high-performance thermal-heat sink that is designed for use in a wide variety of electronic applications. Its use of an innovative leaf-shaped “flower” design allows for direct contact between the device and the heat sink, and its convective cooling mechanism helps to keep the operating temperature at a stable level. With features such as high heat transfer efficiency, low thermal impedance, and a low U-value, the 628-25ABT5 provides optimal thermal management and is perfect for high-power applications such as power semiconductors, IGBT chipsets, and power modules for automotive electronics.

The specific data is subject to PDF, and the above content is for reference