Series:	*
Part Status:	Active

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

.

Heat Sinks

628-35ABT5 Application Field and Working Principle

Heat sinks are specialized components designed to transfer excessive heat away from a system, device, or another component. The 628-35ABT5 heat sink is a high-performance, multi-faceted heat sink designed specifically for cooling processors, transistors, and other components and systems that generate large amounts of heat.Heat transfer from a device to its surroundings depends on several factors. The 628-35ABT5 heat sink is designed to be as efficient as possible in cooling components. Its thermal resistance, or R_th, measures the rise in temperature above ambient caused by the thermal load, as heat is transferred away from the component to the environment. The lower the R_th, the more efficient the heat sink will be, as it allows the heat to dissipate faster and more effectively. The 628-35ABT5 features a series of fins, an improved air flow design, and a large surface area, all of which contribute to its excellent thermal performance.When a processor or other high-dissipating component is mounted onto the 628-35ABT5 heat sink, the heat is dissipated via a number of methods. Convection is one of the most important cooling methods. This occurs when the cooler air surrounding the heat sink is caused to move by the warm air rising from the surface of the component or processor. This circulation of air causes the component or processor to cool off more effectively. Secondly, the 628-35ABT5’s fins increase the surface area of the device, providing more contact points with the air surrounding the device and allowing more thermal energy to be dissipated. The 628-35ABT5 also features a series of plates specifically designed to increase the amount of air circulated around the device. This is known as forced convection, meaning that air is being forced through the various air passages of the heat sink. The result is an even more effective cooling system, as the air is allowed to flow more freely and the device temperatures are significantly reduced.The 628-35ABT5 is most commonly used to cool large processors, but it can also be used to cool other components such as transistors, field effect transistors, and various other electrical components. It is also designed to be used in confined spaces, as its small size and efficient cooling make it ideal for use in a range of tight spaces.In conclusion, the 628-35ABT5 heat sink is a highly efficient cooling system designed specifically for components and systems that generate large amounts of heat. Its excellent thermal performance and ability to be used in tight spaces make it an ideal choice for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference