628-65ABT1E

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are devices that allow heat to dissipate from an object, typically an electronic component, to its surroundings. As such, they are essential in preventing overheating and thus ensuring device performance reliability. The 628-65ABT1E is a direct-touch heat sink, which means it quickly and directly transfers heat from an object to the heat sink without the requirement of an intermediary material.

Application Field:

The 628-65ABT1E is most often used in applications that require efficient cooling. These could include high powered electronic devices, such as PCs or servers, as well as for cooling laser systems, 3D printing machines, or other similar high-end processes.

Working Principle:

The 628-65ABT1E works by using a combination of thermal conduction and thermal convection. Conduction enables heat to be conducted from the heat source to the heat sink. This is done by direct contact between the two devices. Convection involves the movement of hot air away from the sink, allowing cool air to take its place and ensuring that the heat sink remains cool.

The 628-65ABT1E is designed with an array of fins that increase the surface area available for thermal transfer. This, combined with its all-alloy construction, ensures the unit is able to handle a large amount of heat. It is also designed to be easy to install and comes in a range of sizes, making it suitable for many different applications.

In conclusion, the 628-65ABT1E heat sink is a highly effective device for directing and dissipating heat away from heat-producing objects. Its unique combination of conduction and convection ensure a wide variety of applications, making it an excellent choice for many different types of devices.

The specific data is subject to PDF, and the above content is for reference