628-65ABT3

Series:	628
Part Status:	Active

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Introduction

Thermal - Heat Sinks are components used in many electronic products to help dissipate heat away from critical components in order to extend their lifespan and improve their reliability. The 628-65ABT3 is an example of a state-of-the-art thermal solution for high-end electronic assemblies.

Application Field and Working Principle

The 628-65ABT3 is intended for use in electronic products that require high levels of cooling performance due to their intense usage, or for those that have limited space available. The package consists of a large base plate, fins, and top plate. The shape of the fins helps maximize surface area that is exposed to the air, which helps to draw heat away from the components.The 628-65ABT3 works on the principle of convection cooling. The large surface area of the fins provides a large area through which air can flow, and the fan on the base plate pulls air through this surface area to draw heat away from the components. This airflow is directed away from the components to prevent the heat from re-circulating back around the device. In addition to convection cooling, the fins also provide additional cooling through Radiation, as they can absorb heat radiating from the components.

Conclusion

The 628-65ABT3 is an effective and efficient thermal solution that provides both convection and radiation cooling benefits for a variety of applications. The device is compact and fits into tight spaces, and its construction is designed to maximize efficiency and provide exceptional cooling performance. It is suitable for high-end electronic assemblies that have limited space, or those that produce high levels of heat.

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