
Allicdata Part #: | 630-25AB-ND |
Manufacturer Part#: |
630-25AB |
Price: | $ 0.62 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | HEATSINK FOR 35MM BGA |
More Detail: | Heat Sink |
DataSheet: | ![]() |
Quantity: | 1000 |
1800 +: | $ 0.55231 |
Series: | 630 |
Part Status: | Active |
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Thermal management solutions are essential for any electronic device that withstands an elevated operating temperature on a regular basis. A key component in many thermal management solutions is a heat sink. Heat sinks are specifically designed to absorb, retain, and dissipate heat, keeping components cool in a confined space. The 630-25AB heat sink is a popular and effective solution in the realm of thermal management. This heat sink is designed to dissipate significant amounts of heat generated by electronic components while still allowing limited space. It is commonly used in mission-critical and high-reliability aerospace applications such as aircraft and satellites. The 630-25AB heatsink is a reticulated cell foam-coated aluminum heat sink, which makes it relatively lightweight and efficient. It is constructed from both open-cell foam and aluminum foil sheets. This two-part design greatly increases surface area while still containing the thermal energy. The flexibility of the foam allows the heat sink to be formed into nearly any shape or size necessary, and the aluminum ensures maximum heat transfer and low conduction resistance. The 630-25AB heatsink is constructed with several layers of open cell foam, which is then sealed with an outer layer of aluminum foil. This combination of materials provides a thermal resistance that is much better than traditional heatsinks. The foam increases the surface area for better heat dissipation and decreases the thermal resistance by acting as an insulator, while the aluminum foil layer greatly increases the rate at which heat is dissipated. The layers of foam are designed in a specific pattern to maximize the air flow and ventilation inside the heatsink. In terms of performance, the 630-25AB heatsink is highly efficient in dissipating heat. It has a thermal resistance of 0.11°C/W, making it one of the more efficient heatsinks available. The performance of the heat sink is further enhanced by the fact that it requires minimal assembly and is easily adaptable to many different shape and size needs. The 630-25AB heat sink is a reliable and efficient solution for applications where thermal management is essential. It is designed to provide maximum performance and reliability in mission-critical systems, while still requiring minimal space and effort for installation. The combination of open-cell foam and aluminum foil creates a highly efficient thermal resistance that provides superior heat dissipation. Whether the application is for aircraft, satellites, or any other high-reliability system, the 630-25AB heat sink is an ideal solution.
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