| Allicdata Part #: | 630-60AB-ND |
| Manufacturer Part#: |
630-60AB |
| Price: | $ 0.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK FOR BGA 35MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  630-60AB Datasheet/PDF |
| Quantity: | 1000 |
| 1200 +: | $ 0.75720 |
Specifications
| Series: | 630 |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.598" (15.20mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.00°C/W @ 350 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Description
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Thermal - Heat Sinks technology is based on the principle of dissipating heat, which is necessary for the efficient operation of any electronic products. In order to increase the efficiency of the system, the heat must be transferred from the areas of high temperature to the areas of low temperature. The heat sinks are devices which are used to dissipate heat by transferring heat from hotter to cooler areas. In the case of the 630-60AB heat sink, this device is designed to dissipate heat from electrical circuits or other thermal loads.
The 630-60AB thermal - heat sinks is constructed from aluminum alloy and is designed to provide thermal conduction and dissipation. It consists of a plate on which various fins are attached to it. The fins act as mini radiators which increase the surface area of the device for better heat dissipation. Furthermore, the fins are also designed to create a larger area, so that there is more surface area for heat to be dissipated. The fins also have the advantage of allowing air to flow between them and thus increasing the cooling effect by allowing air to circulate around the device.
The thermal design of the 630-60AB is optimized to provide maximum cooling performance and minimize power consumption. This design makes use of high-density aluminum and an efficient design technology to provide thermal conductivity performance. The aluminum of the fins is highly efficient at dissipating heat, which allows for higher performance in thermal response and less heat build-up. An efficient design and improved cooling quality also allow the device to work more efficiently and at lower temperatures.
The 630-60AB thermal - heat sinks is suitable for use in many applications due to its high efficiency and thermal performance. It can be used in a wide range of electronics, including computers, server systems, communication devices and medical devices. These applications require a high performance thermal management system in order to provide excellent performance and reliability. The 630-60AB is a great choice for thermal management in these applications and provides reliable operation in harsh environments.
The 630-60AB thermal - heat sinks also features a unique design which allows for better airflow over the surfaces of the fins. The airflow helps to dissipate heat more efficiently and thus improve the performance of the device. This design also helps to minimize dust buildup, which could lead to decreased performance due to excessive heat buildup.
Overall, the 630-60AB thermal - heat sinks is an efficient and reliable thermal management device that provides excellent performance and reliability. It is used in many applications due to its high performance and excellent design. Its unique airflow design helps to dissipate heat more efficiently and improve the performance of the device. Moreover, its aluminum construction makes it highly efficient at dissipating heat and minimizing dust buildup.
The specific data is subject to PDF, and the above content is for reference
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