642-25AB Allicdata Electronics
Allicdata Part #:

642-25AB-ND

Manufacturer Part#:

642-25AB

Price: $ 0.64
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK FOR 35MM BGA
More Detail: Heat Sink
DataSheet: 642-25AB datasheet642-25AB Datasheet/PDF
Quantity: 1000
1600 +: $ 0.57903
Stock 1000Can Ship Immediately
$ 0.64
Specifications
Series: *
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks, a primary component for heat transfer, are used to pull heat away from a hot surface, mainly electronic components, in order to prevent overheating. Heat sinks come in various shapes and sizes with some containing heat pipes and others containing pin array and stacked fins. The 642-25AB Heat Sink is built with extruded aluminum and is a relatively small, low-cost solution for cooling electronic components. With dimensions of 31x45x48mm, the 642-25AB Heat Sink is suitable for applications in offices, factories, and transportation products.

The 642-25AB Heat Sink has a very simple and effective working principle. Heat is transferred from the device to the heat sink using thermal contact. The thermal contact may be provided by a thermal paste or a thermal conductive pad. The heat is then transferred from the heat sink to the environment through the aluminum body and fins. The extruded aluminum body is designed to have a larger surface area for more efficient heat transfer, maximize convection cooling, and dissipate the heat away quickly.

The 642-25AB Heat Sink is used mainly in applications such as circuit boards, embedded systems, communication systems, audio systems, automotive sub-assemblies, and medical instruments. Its slim design allows it to be embedded tightly between components in a circuit board, and its low profile ensures better compatibility with other components and adds to its durability. This heat sink\'s relatively low cost makes it an attractive solution for applications where heat dissipation is important but budget is a factor.

The 642-25AB Heat Sink is capable of dissipating a wide range of wattage, from 0.5W to 25W, making it a versatile solution for both low-power and high-power applications. With its high-performance thermal capabilities, it provides superior heat dissipation for applications where fast cooling is critical. This makes it ideal for applications such as embedded processors and audio amplifiers.

The 642-25AB Heat Sink is easy to install and comes with an array of mounting holes that allow for a secure fit. This heat sink is also designed for long-term use, so it can provide reliable heat transfer for years. Its aluminum extrusion construction makes it corrosion-resistant and ensures that it will work optimally for many years, even in rugged environments.

In summary, the 642-25AB Heat Sink is a reliable, low-cost solution for cooling electronic components in a variety of applications. Its slim design and array of mounting holes make it easy to install and its high-performance thermal design ensures reliable and efficient heat transfer. With its corrosion-resistant construction and wide wattage range, the 642-25AB Heat Sink is a great choice for applications where long-term operation is a must.

The specific data is subject to PDF, and the above content is for reference

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