Allicdata Part #: | 642-25ABT1E-ND |
Manufacturer Part#: |
642-25ABT1E |
Price: | $ 0.92 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | HEATSINK FOR 35MM BGA |
More Detail: | Heat Sink |
DataSheet: | 642-25ABT1E Datasheet/PDF |
Quantity: | 1000 |
1600 +: | $ 0.82846 |
Series: | * |
Part Status: | Active |
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Thermal - Heat Sinks are components used for transferring heat away from components, devices, and systems that generate heat. The 642-25ABT1E is an aluminum extruded heat sink with a low profile that is often used for applications that require greater cooling capacity.
This profile was designed to allow for better air circulation around the heat sink and provides higher thermal conductivity. It also features high performance fins to disperse heat more efficiently thereby reducing fan noise that some applications require. The hollow shape of this heat sink allows it to be installed in tight spaces, making installation easier in applications with limited space.
The 642-25ABT1E is constructed from a light-weight aluminum alloy that is both strong and lightweight. This material is designed to dissipate heat quickly and efficiently. It is also UL recognized and RoHS compliant, making it a safe and reliable product to use for your applications. The aluminum alloy also provides excellent resistance to rust and corrosion, making it an ideal choice for applications used in outdoor environments.
The 642-25ABT1E is designed to be used in a wide variety of applications, including automotive, computer, and electronics cooling. It is often used in applications that generate a high amount of heat, such as CPUs, GPUs, power converters, and high-power components. For instance, it is commonly used in CPUs, video cards, motherboards, and power supplies.
The working principle of the 642-25ABT1E heat sink is simple. Heat is drawn away from the component or device being cooled by the heat sink and dissipated into the air around it. This process helps keep components and systems running at optimal temperatures, thereby improving their performance and reliability. Additionally, heat sinks can be used to improve the efficiency of cooling systems, as the heat generated by components or devices can be dissipated more quickly.
The 642-25ABT1E heat sink is designed to be mounted on the bottom of a device or component. It is typically mounted using mounting screws and comes with some type of thermal grease or interface pad for optimal contact between the heat sink and the device being cooled. Additionally, some users may opt to use a double-sided thermal tape or pad to increase the effectiveness of the heat sink.
In conclusion, the 642-25ABT1E is a thermal heat sink designed for a wide range of applications where optimal cooling capacity is required. It features lightweight aluminum alloy construction with high performance fins for efficient heat dissipation. Additionally, it can be easily installed in limited spaces due to its slim profile. Furthermore, the working principle of the heat sink is simple, drawing away heat from components and dissipating it into the surrounding air. With these features, the 642-25ABT1E heat sink is an excellent choice for applications that need reliable and effective cooling.
The specific data is subject to PDF, and the above content is for reference