642-60ABT4E

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are used to reduce the temperature of an electronic device by dissipating heat away from the device. Thermalmanagement with heat sinks is an important aspect of electronic device design. The 642-60ABT4E heat sink is designed to provide efficient thermal management in a wide variety of configurations.

The most common application for 642-60ABT4E heat sinks is cooling high-power electrical components and computer systems. These heat sinks were designed to help keep high-powered devices such as CPUs, GPUs, and other power-hungry components operating at their optimal levels. The 642-60ABT4E heat sink uses an efficient copper-and-aluminum construction to conduct heat away from the device quickly and effectively.

The 642-60ABT4E heat sink\'s design also includes a unique ‘micropin’ feature that improves the thermal transfer from the heat sink to the device. The micropin technology helps the heat sink absorb heat from the device more quickly and efficiently than traditional heat sinks. The 642-60ABT4E heat sink also has an innovative fin design which increases the surface area of the heat sink, allowing more air to circulate around the device and helping to increase the heat transfer rate.

The 642-60ABT4E heat sink is designed to be mounted to the device’s PCB with screws or clips. The mounting process is simple and straightforward, ensuring that the heat sink is securely attached to the device. Once mounted, the 642-60ABT4E heat sink is designed to perform optimally even in harsh environmental conditions.

The 642-60ABT4E heat sink can also be paired with other thermal management products to create a complete thermal management solution. For example, the 642-60ABT4E heat sink can be paired with fans, heat spreaders, and other components to improve overall system thermal management. The 642-60ABT4E heat sink is an effective and efficient thermal management solution for applications that require high performance, reliability, and flexibility.

The 642-60ABT4E heat sink is an effective and efficient thermal management solution for applications that require high performance, reliability, and flexibility. It uses an efficient copper-and-aluminum construction to conduct heat away from the device quickly and effectively, and it has an innovative fin design which increases the surface area of the heat sink, allowing more air to circulate around the device and helping to increase the heat transfer rate. The 642-60ABT4E heat sink can also be paired with other thermal management products to create a complete thermal management solution. As a result, the 642-60ABT4E heat sink is a great choice for applications where efficient thermal management is required.

The specific data is subject to PDF, and the above content is for reference