646362-1 Allicdata Electronics
Allicdata Part #:

646362-1-ND

Manufacturer Part#:

646362-1

Price: $ 4.05
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: 2MM HM ASY,T-D,HDR,8R,128P
More Detail: 128 Position Header, Male Pins Connector 0.079" (2...
DataSheet: 646362-1 datasheet646362-1 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
468 +: $ 3.67983
Stock 1000Can Ship Immediately
$ 4.05
Specifications
Series: Z-PACK
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Type: Header, Male Pins
Connector Style: D 16
Number of Positions: 128
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 8
Mounting Type: Through Hole
Termination: Press-Fit
Connector Usage: --
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Current Rating: 1.5A
Voltage Rating: 750Vrms
Operating Temperature: -55°C ~ 125°C
Features: Board Guide
Description

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Backplane connector technology is one of the most important innovations in electronics, and 646362-1 is an example of hard metric backplane connectors that provide a solution to today’s challenges. This standard allows for a high degree of flexibility in interconnect solutions while allowing manufacturers to maintain a certain level of uniformity with their products.

At its core, 646362-1 uses a combination of rigid and flexible materials to create a standard backplane and multi-row connector system. This system includes a number of features such as board-to-board interconnects and power-input and signal-output connectors. The system also provides an interior cable harness for power and signal routing and a latency-controlled power distribution frame.

The rigid and flexible materials used in 646362-1 provide a number of benefits. The rigid materials ensure a dependable connection between components, while the flexible material allows for greater flexibility in the design. In addition, the system ensures a tight fit between boards, as well as providing the necessary thermal and mechanical protection for components.

As the name implies, 646362-1 is designed to be hard-metric compliant. This means that all components are designed to match the same physical and electrical requirements. This allows manufacturers to produce products of a consistent quality that are fully interchangeable. The system also ensures that all connections are secure and reliable, while still allowing for modifications to individual components.

In addition to its hard-metric compliance, 646362-1 also offers a high level of performance. The system is rated to ensure the reliability and integrity of connections and the protection of components from environmental hazards. It also allows for the transmission of data and signals at a higher rate than other formats.

The 646362-1 system is ideal for applications that require a high level of reliability and data transmission rate. This includes communication systems, radar systems, medical equipment, computer systems, and digital consumer electronic products. It can be used in a wide variety of environments, including high-temperature, high-pressure, and hostile environments.

Finally, 646362-1 offers a high level of scalability. This allows architects and engineers to design the best possible system for a given application without having to worry about replacing components in the future. This scalability also allows system designers to make changes and upgrades that can be built into the system as the need arises.

As a hard-metric backplane connector system, 646362-1 offers a powerful and reliable solution for a variety of applications. The system provides the performance, reliability, and scalability necessary to meet the demands of today’s advanced electronics, while still allowing for a uniform and consistent design. With its combination of rigid and flexible materials, 646362-1 ensures the protection of components, while allowing for a high level of data transmission rate and scalability.

The specific data is subject to PDF, and the above content is for reference

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