| Allicdata Part #: | 345-1093-ND |
| Manufacturer Part#: |
655-53AB |
| Price: | $ 1.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK CPU 40.6MM SQ H=.525" |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  655-53AB Datasheet/PDF |
| Quantity: | 2727 |
| 1 +: | $ 1.23480 |
| 10 +: | $ 1.20078 |
| 25 +: | $ 1.16827 |
| 50 +: | $ 1.10338 |
| 100 +: | $ 1.03843 |
| 250 +: | $ 0.97355 |
| 500 +: | $ 0.94109 |
| 1000 +: | $ 0.84373 |
| 5000 +: | $ 0.82751 |
| Series: | 655 |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.600" (40.64mm) |
| Width: | 1.600" (40.64mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.522" (13.27mm) |
| Power Dissipation @ Temperature Rise: | 4.0W @ 40°C |
| Thermal Resistance @ Forced Air Flow: | 2.00°C/W @ 400 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
655-53AB Application Field and Working Principle
The 655-53AB is a thermal heat sink that is used in various industrial, commercial, and residential applications. It is a passively cooled heat sink which utilizes convection to remove excess heat. The 655-53AB offers superior efficiency and performance in applications that require low surface temperatures, and is used in circuit boards, power supplies, microprocessors, and other components.
Applications
The 655-53AB is designed for use in various applications including automotive, telecommunication, and electronics cooling. Examples of these applications include telecommunication equipment, computers, consumer electronics, computer peripherals, medical systems, and industrial automation equipment.
The 655-53AB is ideal for use in applications where the heat generated is too much for the system to dissipate on its own. For example, it is commonly used in high power microprocessors, hard disk drives, and other components that generate lots of heat. By using a thermal heat sink, the excess heat can be removed, and the system can be cooled efficiently.
Design
The 655-53AB is designed to be lightweight and compact, yet provide superior cooling performance. It is made from anodized aluminum, which is lightweight, yet extremely strong and reliable.
The 655-53AB is designed with a two-piece construction. The base is the primary heat spreader and the fins are connected to the heat spreader via screws. The fins are made from aluminum to provide excellent thermal conductivity. The fins are also designed to create optimal airflow, which helps to dissipate the heat quickly.
Working Principle
The 655-53AB works by dissipating heat through convection. As the heat from the components is transferred to the heat sink, hot air rises and is replaced by cooler air. This cycle is repeated until the heat is dissipated and the temperature of the system is within the operating range.
The 655-53AB is designed to be efficient and reliable. It is designed to work in a wide range of temperatures and can accommodate large amounts of heat. This makes the 655-53AB an ideal choice for applications that require reliable and efficient thermal management.
The specific data is subject to PDF, and the above content is for reference