658-25ABT1 Allicdata Electronics
Allicdata Part #:

345-1063-ND

Manufacturer Part#:

658-25ABT1

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK CPU 28MM SQ BLK W/TAPE
More Detail: Heat Sink BGA Aluminum 2.0W @ 40°C Top Mount
DataSheet: 658-25ABT1 datasheet658-25ABT1 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: 658
Part Status: Obsolete
Type: Top Mount
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 1.100" (27.94mm)
Width: 1.100" (27.94mm)
Diameter: --
Height Off Base (Height of Fin): 0.250" (6.35mm)
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 500 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks are one of the most widely used and important components in modern power electronics, ranging from computers and consumer electronics to power converters and more. The 658-25ABT1 is a specialized type of thermal heat sink designed for use with certain high power electronic components, and is commonly used to prevent heat-induced damage or other premature failures due to overheating.The 658-25ABT1 is a four-finned, single-stack configuration heat sink. It features a stack height of 25mm and a base size of 55mm x 55mm, making it a great choice for mounting to high-power components. The particular specialty of the 658-25ABT1 is its unique fin orientation resulting in superior thermal performance. This top-set fin arrangement enables the 658-25ABT1 to provide an effective thermal resistance value of 0.12K/W @ 500 lfm.The 658-25ABT1 is most commonly used in power converters in order to help dissipate the high levels of heat generated by these components. Power converters often use high current level components such as transformers, IGBTs, and MOSFETs, each of which generates a significant amount of heat. Without proper cooling, these components can suffer from thermal damage, leading to premature failure and decreased performance. The 658-25ABT1 is designed to enhance the cooling capability of these components, as the fins draw heat away from the components and allow air to flow over them, helping to dissipate the heat that is generated.The 658-25ABT1 is highly effective in dissipating heat in order to protect these electronic components and maintain their lifespan. The 658-25ABT1 can be mounted to a variety of components using different techniques, including the use of resin pads, screw mounting, and thermal epoxy. It is also designed to operate in a wide range of temperature environments, from 0° C to 110° C.In addition to its excellent thermal performance, the 658-25ABT1 is also designed to be easy to install and use. It has a lightweight construction that makes it easy to mount and secure in place, and it can also be mounted directly onto other components or to a circuit board using thermal epoxy.The 658-25ABT1 is an excellent choice for thermal management of power converters and other high-power electronic components. Its versatile mounting design, excellent thermal performance, and robust construction make it a great choice to maintain the longevity and performance of your electronics.

The specific data is subject to PDF, and the above content is for reference

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