658-25ABT2

Series:	658
Part Status:	Obsolete
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	1.100" (27.94mm)
Width:	1.100" (27.94mm)
Diameter:	--
Height Off Base (Height of Fin):	0.250" (6.35mm)
Power Dissipation @ Temperature Rise:	2.0W @ 40°C
Thermal Resistance @ Forced Air Flow:	5.00°C/W @ 500 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks

The 658-25ABT2 is a thermal management component used to manage the process of transferring heat away from a heated component, such as an integrated circuit. The device is commonly referred to as a "heat sink." Heat sinks are components of a system that must be managed in order to optimize system performance and ensure that the components remain within operational limits.

Application Field

Heat sinks are used extensively in the electronics industry to ensure that overheating problems are avoided. This particular device is used in applications where power dissipated from the heated component is up to 25 Watts and the temperature of the heat sink is limited to 150°C. The 658-25ABT2 is designed to be used in applications that present issues related to both convection and thermal conduction.

Working Principle

The 658-25ABT2 works by transferring the heat away from the heated component and dissipating it through the thermal conduction process. This is accomplished by using a thin aluminum base that is joined to an extruded aluminum finned heat-sink body. In some cases, a copper heat-pipe may also be used to improve thermal performance. The device also has a mounting system that allows for easy installation and maximizes surface contact with the heated component.The device works by using the laws of thermodynamics to facilitate heat transfer. Heat is transferred from the heated component to the aluminum base of the heat sink and then to the finned body. The resultant thermal energy is then dissipated by convection in the local environment or is released to the atmosphere, depending on the configuration. If the heat sink is mounted with a copper heat-pipe, then the thermal energy is transferred through the walls of the heat-pipe and released to the atmosphere.

Conclusion

The 658-25ABT2 is a thermal management component designed to facilitate the process of transferring heat away from a heated component. It is a versatile device that can be used in many different applications where thermal management is required and the temperature of the heat sink is limited to 150°C. The device works to transfer the thermal energy through thermal conduction and convection and allows for efficient heat transfer to the atmosphere.

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