| Allicdata Part #: | 345-1096-ND |
| Manufacturer Part#: |
658-25ABT3 |
| Price: | $ 1.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK CPU 28MM SQ BLK W/TAPE |
| More Detail: | Heat Sink BGA Aluminum 2.0W @ 40°C Top Mount |
| DataSheet: |  658-25ABT3 Datasheet/PDF |
| Quantity: | 589 |
| 1 +: | $ 1.41750 |
| 10 +: | $ 1.37718 |
| 25 +: | $ 1.34014 |
| 50 +: | $ 1.26554 |
| 100 +: | $ 1.19114 |
| 250 +: | $ 1.11671 |
| 500 +: | $ 1.07948 |
| 1000 +: | $ 0.96781 |
| 5000 +: | $ 0.94920 |
| Series: | 658 |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.100" (27.94mm) |
| Width: | 1.100" (27.94mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.250" (6.35mm) |
| Power Dissipation @ Temperature Rise: | 2.0W @ 40°C |
| Thermal Resistance @ Forced Air Flow: | 5.00°C/W @ 500 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Heat can be a major issue for electronic components. The heat generated from the component can lead to overheating, and reduced performance levels. This is why it is important to ensure that the components are effectively cooled, and this is where the 658-25ABT3 comes in. This thermal-heat sink is designed to draw the heat away from the component, and disperse it into the surrounding area. In this article, we will explore the application field and working principle of the 658-25ABT3 thermal-heat sink.
The application field of the 658-25ABT3 thermal-heat sink is broad. It is designed to be able to effectively draw the heat away from a variety of components, including processors, power supplies, and other electrical components. It is able to draw heat even from smaller components where other thermal-heat sinks may not be effective. This makes it ideal for use in commercial and industrial applications.
The working principle of the 658-25ABT3 thermal-heat sink is based on a simple design. The heat sink is constructed from a heat-conductive aluminum material, which allows it to effectively absorb the heat from the component it is attached to. It also features a finned design, which helps to further distribute heat away from the component. The heat sink also utilizes a fan, which helps to further draw the air away from the component and disperse it into the surrounding area.
The 658-25ABT3 thermal-heat sink is designed to be efficient and reliable. It is easy to install, and features a low noise operation. The heat sink is also durable, and able to withstand high temperatures. It is also designed to be lightweight, allowing for easy installation and transport. The 658-25ABT3 offers a great balance between performance and cost, making it an ideal choice for a variety of applications.
In conclusion, the 658-25ABT3 thermal-heat sink is an efficient and reliable option for cooling a range of electronic components. It is easy to install, and able to effectively draw the heat away from the components, and disperse it into the surrounding area. The lightweight and low noise design of the 658-25ABT3 makes it a great choice for many applications where effective cooling is needed.
The specific data is subject to PDF, and the above content is for reference