658-35ABT4E Allicdata Electronics
Allicdata Part #:

345-1100-ND

Manufacturer Part#:

658-35ABT4E

Price: $ 1.58
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK CPU 28MM SQ BLK W/TAPE
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: 658-35ABT4E datasheet658-35ABT4E Datasheet/PDF
Quantity: 4170
1 +: $ 1.43640
10 +: $ 1.40112
25 +: $ 1.36307
50 +: $ 1.28722
100 +: $ 1.21149
250 +: $ 1.13579
500 +: $ 1.09794
1000 +: $ 0.98435
5000 +: $ 0.96543
Stock 4170Can Ship Immediately
$ 1.58
Specifications
Series: 658
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 1.100" (27.94mm)
Width: 1.100" (27.94mm)
Diameter: --
Height Off Base (Height of Fin): 0.350" (8.89mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 800 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical aspect of modern electronic design — especially as component density increases. Many components, such as processors, require high levels of heat dissipation to function satisfactorily. Heat sinks, such as the 658-35ABT4E, are devices designed to passively dissipate heat generated by electric components. In this article, we\'ll discuss the application field and working principle of the 658-35ABT4E.The 658-35ABT4E is a heat sink designed for applications that require high levels of thermal dissipation. It is a robust and reliable heat sink, capable of dissipating up to 35 watts of heat efficiently. The 658-35ABT4E has an extruded aluminum body with a black anodized finish. This design provides a large surface area for efficient heat transfer and enables the device to dissipate heat effectively, even in cramped and enclosed spaces.The 658-35ABT4E is suited for a wide variety of applications. It can be used in high-power processors, high-performance gaming computers, industrial systems, and other electronic devices that require effective thermal management. In addition, the 658-35ABT4E is ideal for applications requiring high levels of noise suppression. The device is also ideal for applications where a low profile design is required.The working principle of the 658-35ABT4E is relatively straightforward and is based on the principles of conduction. Heat generated by an electronic component is dissipated through the aluminum body of the heat sink to its external surfaces. This process occurs due to the thermal conductivity of the aluminum and the convective cooling resulting from the air in contact with the external surfaces of the device.The 658-35ABT4E has several features that enhance its performance. For instance, the device is designed with large cooling fins, which increase the surface area available for heat transfer. This, combined with the robust aluminum body, allows the device to achieve greater levels of heat dissipation. In addition, the device features multiple layers, which help to reduce noise.In conclusion, the 658-35ABT4E is an excellent heat sink for applications that require high levels of thermal dissipation. It is suitable for a variety of applications, including high-power processors, high-performance gaming computers, industrial systems, and other noise-sensitive applications. The device is designed with a robust aluminum body and large cooling fins, which enable it to dissipate heat effectively. Its multiple layers also help to reduce noise levels.

The specific data is subject to PDF, and the above content is for reference

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