659-65ABT5 Allicdata Electronics
Allicdata Part #:

659-65ABT5-ND

Manufacturer Part#:

659-65ABT5

Price: $ 0.94
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK EXTRUSION 37MM
More Detail: Heat Sink
DataSheet: 659-65ABT5 datasheet659-65ABT5 Datasheet/PDF
Quantity: 1000
1200 +: $ 0.84373
Stock 1000Can Ship Immediately
$ 0.94
Specifications
Series: *
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a crucial part of modern electronics. Heat sinks are an integral component for cooling high-powered devices, allowing them to dissipate heat efficiently and increase their efficiency and performance. The 659-65ABT5 heat sink is a uniquely designed heat sink specifically designed for cooling applications which require a lightweight design, high cooling performance, and a low profile. It is designed to cool high-powered electronics, such as CPUs, GPUs, FPGAs, and other high-powered components.

The 659-65ABT5 heat sink is specifically designed to maximize heat dissipation in electrical applications where a lightweight design is needed, but where a high degree of cooling performance is necessary. It features a unique fin design which ensures maximum surface area exposure for maximum heat evacuation. It also features a low-profile design, which ensures that the sink will fit in even the most cramped areas. The fins are constructed with aluminum and copper, which helps to provide superior thermal dissipation performance.

The working principle of the 659-65ABT5 heat sink is simple yet effective. The aluminum fins allow for maximum heat evacuation from the heat source. The copper coils placed within the fin array act as additional heat exchangers, allowing more efficient cooling compared to a pure aluminum design. The large surface area of the fins combined with the copper coils allows for superior cooling performance. Additionally, the fins are angled in order to help create a convective airflow around the heat source, thus further increasing its cooling efficiency. The heat sink is designed to be both lightweight and compact, making it ideal for use in a wide range of thermal management applications.

The 659-65ABT5 is an excellent choice for electronic applications that require a lightweight and efficient cooling solution. Its low profile design ensures that it will fit in the tightest of spaces, while its high cooling performance ensures that the cooling needs of the device are met. The unique design of the fins and copper coils makes it ideal for high-powered electronic components, while its lightweight construction makes it easy to install and service.

The specific data is subject to PDF, and the above content is for reference

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