660-29AB Allicdata Electronics
Allicdata Part #:

660-29AB-ND

Manufacturer Part#:

660-29AB

Price: $ 0.57
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK EXTRUSION 37MM
More Detail: Heat Sink
DataSheet: 660-29AB datasheet660-29AB Datasheet/PDF
Quantity: 1000
1300 +: $ 0.51668
Stock 1000Can Ship Immediately
$ 0.57
Specifications
Series: *
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal – Heat Sinks is an important element in the cooling process of many electronic devices. It helps to reduce waste heat dissipated by the device, thereby increasing the life of the device and enhancing its performance. The 660-29AB is a popular Thermal – Heat Sink used in many electronic applications. This article looks at the 660-29AB application field and working principle.

The 660-29AB is a heatsink designed to be used with 200Watt surface mount power semiconductor modules. It consists of an aluminum base and a clip which helps to fasten it to the module. The base is made of a highly conductive aluminum alloy which helps to improve the thermal conductivity of the device. The base is then covered with a copper cover which helps to protect the base from corrosion and oxidation. The base and cover are then fitted with two fins which are used to increase the surface area of the device for more efficient cooling.

The 660-29AB is mainly used in audio power amplifiers, DC-DC converters and server applications. It provides efficient cooling to the components of these devices. The clip helps to secure the heatsink onto the surface mount module. The base and fins help to dissipate the heat away from the module quickly and efficiently. The copper cover helps to protect the base from corrosion and oxidation.

The working principle of the 660-29AB is relatively simple. Heat produced by the device is dissipated through the heatsink by conduction. When the thermal energy is conducted through the heatsink it is transferred to the fins, which allows the heat to dissipate to the atmosphere within the enclosure. The heatsink is also able to take the heat away faster due to its increased surface area. The aluminum base of 660-29AB helps to improve the heat transfer performance of the heatsink.

In conclusion, the 660-29AB is a popular Thermal – Heat Sink. It is designed to be used with 200Watt surface mount power semiconductor modules. The clip helps to secure the heatsink onto the module. The base and fins help to dissipate the heat away from the module quickly and efficiently. The copper cover helps to protect the base from corrosion and oxidation. The working principle of the 660-29AB is relatively simple and it helps to improve the cooling performance of the electronic device.

The specific data is subject to PDF, and the above content is for reference

Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics