660-29ABT4E

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks is an essential component for modern CPU/GPU computers. Heat sinks are designed to improve the overall thermal performance of the system by dissipating heat away from the core components. The 660-29ABT4E heat sink is a popular model of thermal-heat sink, designed for superior performance and unparalleled cooling power. This article will provide an overview of the 660-29ABT4E heat sink, including its application field, working principles and an evaluation of its effectiveness.

The 660-29ABT4E heat sink is a large-sized dual-stack heat sink. It has two heat pipes, with enclosed fins, which allow for great heat transfer performance, enabling it to cool even the hottest CPUs/GPUs. It is designed for large air-cooled systems, and has a volumetric capacity up to 102 cubic inches. This size makes it suitable for larger dissipation requirements, such as those found in overclocked systems.

The 660-29ABT4E heat sink utilizes the principles of thermal convection to transfer heat away from the core components. The design of the heat sink works by allowing air to flow through the enclosed fins, the heat pipes, and then out of the system. As air passes through the system, it absorbs the heat from the thermal interfaces and transfers it away from the components. This mechanism of thermal convection helps to keep the system at a lower temperature than it would be without the heat sink, improving the overall cooling performance.

The 660-29ABT4E heat sink utilizes its superior thermal performance to cool a wide variety of components in state-of-the-art computers. The heat sink can be used to cool CPUs, GPU, and memory chips, as well as other components on the motherboard. The 660-29ABT4E heat sink is also suitable for use with dual-fan coolers, which can help further reduce the overall temperature and improve the cooling efficiency.

The 660-29ABT4E heat sink is effective in cooling CPUs and GPUs, but the technology has some limitations when it comes to cooling memory chips. The large size of the heat sink makes it unsuitable for use in small form-factor computers, where there is limited space for the heat sink to fit. Additionally, its thermal performance is limited by the effectiveness of the thermal interfaces used to connect the components to the heat sink.

Overall, the 660-29ABT4E heat sink has proven to be an effective component for cooling and dissipating heat. It provides consistent performance and reliable cooling, making it a popular option for various systems. The thermal performance and size of the 660-29ABT4E heat sink make it suitable for a variety of applications, ranging from large air-cooled systems to small form-factor computers. Its performance and efficiency make it an attractive option for users looking to extend the life of their computer components and ensure consistent performance.

The specific data is subject to PDF, and the above content is for reference