Allicdata Part #: | 662-15ABT3-ND |
Manufacturer Part#: |
662-15ABT3 |
Price: | $ 1.65 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | HEATSINK EXTRUSION 45MM |
More Detail: | Heat Sink |
DataSheet: | 662-15ABT3 Datasheet/PDF |
Quantity: | 1000 |
1360 +: | $ 1.48067 |
Series: | * |
Part Status: | Active |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The 662-15ABT3 thermal - heat sink is an important tool in many applications. This thermal - heat sink is designed to dissipate heat from electrical components, allowing the component to maintain its temperature within specified ranges and to operate efficiently. This heat sink is primarily designed for use in medium and high power applications, including power converters, RF amplifiers, power transistors, and high power LEDs.
The 662-15ABT3 heat sink is made from an aluminum alloy, which helps dissipate heat, while providing structural strength and durability. The overall profile of the heat sink is rectangular and it has a slidable mounting bracket at one end. The total length of the heat sink from tip to tip is 6.62 inches, while the total width is 1.5 inches. Its total height is 0.7 inches, with its base at 0.24 inches thick. This heat sink is designed to accommodate industry standard components.
The primary application of the 662-15ABT3 thermal - heat sink is in the thermal management of electrical components. The heat is conducted from the device to the heat sink body, which then dissipates it away to the environment. The heat conducting surface area of this heat sink is optimized for maximum heat transfer. The heat sink can be mounted to the component or secured to an enclosure for effective cooling. This heat sink is ideal for dissipating large amounts of heat from medium and high power components.
The working principle behind this heat sink is based on the fact that heat is constantly moving from areas of higher temperature to areas of lower temperature. This heat sink takes advantage of the nature of thermal conduction and makes it an effective way to remove heat from components. The heat sink body is in direct contact with the device, providing a path for the heat to travel and dissipate away from the device. The base of the heat sink is generally connected to a heat spreader or cooled by a fan. This helps to move the heat quickly away from the device and provides a more efficient cooling solution.
The 662-15ABT3 thermal - heat sink is a highly effective means of dissipating heat from straining electrical components. Its substantial surface area provides an efficient means of transferring heat from the device to the heat sink, after which it is quickly removed from the system with the aid of a heat spreader or a fan. This helps to ensure that the device operates within specified temperature ranges, allowing it to operate reliably, continually, and efficiently.
The specific data is subject to PDF, and the above content is for reference