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Part Status:	Active

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Thermal - Heat Sinks

Heat sinks are used to dissipate heat generated by electrical components in order to maintain effective operating temperatures. An efficient heat sink should enable a decrease of temperature by cooling the components adequately and quickly removing the generated heat. 669-40AB is a heat sink designed to provide adequate cooling and heat dissipation. 669-40AB is manufactured with anodized aluminum and equipped with an integral silicone thermal pad. It is designed to provide efficient thermal transfer from the component to the heat sink, and it is designed for use with semiconductor power devices and automotive sensor applications.The 669-40AB has an operating temperature range of -40°C to +150°C. It is designed with both optimized natural and forced air-cooling capabilities. For natural air-cooling, it can dissipate up to 30 W of heat. With forced air-cooling, it can dissipate up to 70 W of heat.The 669-40AB is designed with an extruded body that allows for four threaded mounting holes on its bottom surface for attaching it to a heatsink, chassis, or other heat conduit. The body of the heat sink also features two tabs for attaching a fan. The heat sink also features a natural convection design with fins arranged in a teardrop arrangement to promote air flow and maximize heat transfer.The thermal pad on the bottom surface of the 669-40AB consists of anodized aluminum and silicone material. This material is designed to make optimum thermal conduction between the component and the heat sink. The geometry of the thermal pad ensures that the thermal contact between the heat sink and the component is uniform, providing for optimum contact force and thermal performance.The 669-40AB heat sink is also designed to be easy to install and maintain. The mounting holes and tabs are designed to make for easy installation and removal of the heat sink. Additionally, the thermal pad is designed to be easy to remove, clean, and replace as necessary.In summary, the 669-40AB heat sink is designed to provide efficient thermal transfer from the component to the heat sink and is suitable for semiconductor power devices and automotive sensor applications. It is designed with both optimized natural and forced air-cooling capabilities and features four threaded mounting holes and two tabs for attaching a fan for maximum heat dissipation. The thermal pad on the bottom surface ensures optimum contact force and thermal performance. Overall, the 669-40AB heat sink is designed with ease of installation and maintenance in mind.

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