| Allicdata Part #: | 345-1044-ND |
| Manufacturer Part#: |
677-10ABP |
| Price: | $ 0.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK MULTIWATT 1.0" BLK |
| More Detail: | Heat Sink TO-218, TO-220, TO-247, Multiwatt Alumin... |
| DataSheet: |  677-10ABP Datasheet/PDF |
| Quantity: | 1000 |
| 1200 +: | $ 0.84373 |
| Series: | 677 |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-218, TO-220, TO-247, Multiwatt |
| Attachment Method: | Bolt On and PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.000" (25.40mm) |
| Width: | 1.650" (41.91mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.000" (25.40mm) |
| Power Dissipation @ Temperature Rise: | 6.0W @ 52°C |
| Thermal Resistance @ Forced Air Flow: | 3.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 8.70°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management has become increasingly important in a wide variety of industrial and consumer applications. The 677-10ABP is a heat sink device that is designed to efficiently manage and dissipate heat generated from power consuming components, such as processors, sensors, and other electronic components. It is employed in order to ensure the safety and correct functionality of the system being cooled.
In many instances, semiconductor components contain an integrated circuit, which plays a vital role in the performance of a certain device. As the power for the integrated circuit increases, so does the heat generated. If this heat is not quickly and effectively dissipated, it can cause damage to the components and even cause the system to malfunction. The 677-10ABP dissipates heat by channelling air flow to move the heat away from the device and safely out of the system.
Initially, the 677-10ABP is installed on the base of the device or motherboard. It includes several points of contact that are designed to optimize heat dissipation. These contact points, also known as ‘fins’, play an integral role in the effective performance of the device. The fins are designed to capture the airflow directed to the device and dissipate the heat quickly. The fins also help create a ‘boundary layer’ that helps to insulate the device from nearby heat.
The 677-10ABP is also equipped with a heat transfer interface that helps ensure the efficient distribution of airflow and heat dissipation across the various components of the device. The interface is designed to maximize the contact surface area of the fins. This increases the accuracy and speed at which heat can be transferred away from the device. Additionally, the 677-10ABP is designed to maintain low operating temperatures and protect components from overheating.
The main advantage of the 677-10ABP is its efficient performance. It is designed to manage the dissipate heat quickly and effectively while also ensuring the safety of the device. This helps to prolong the life span of the components and prevents any possible damage or malfunction. The 677-10ABP is also a cost-effective solution, as it requires minimal maintenance and installation fees.
In conclusion, the 677-10ABP is a highly efficient thermal management device that is designed to protect sensitive components and keep them running smoothly. It works by channelling airflow through its fins to quickly dissipate heat, while also providing insulation from other nearby heat sources. It is a highly cost-effective solution, making it an ideal solution for ensuring the proper functioning and safety of a wide variety of power consuming components.
The specific data is subject to PDF, and the above content is for reference